Abstract: An enclosed, electronic system has a plurality of lower power-dissipating electronic components mounted on a chassis. The components are positioned adjacent each other to form low volume fluid ducts therebetween. A low volume fluid duct is formed between one side of the plurality and one end enclosure of the system. At least one higher power-dissipating electronc component is also mounted on the chassis, forming a high volume fluid duct between one of its sides and one side of the last of the lower power-dissipating electronic components, and a high volume fluid duct also formed between the other side of the higher power-dissipating electronic component and the other end enclosure. Air is caused to blow through the low volume fluid duct and then to be exhausted through the high volume fluid ducts. The rate of air flow through the high volume ducts is one half of the minimum required to cool the higher power-dissipating component.