Abstract: A video decoding method and apparatus receives a motion compensation shader command, such as a packet, for a programmable shader of a 3D pipeline, such as programmable vertex shaders and pixel shaders, to provide motion compensation for encoded video, and decode the encoded video using the programmable shader of the 3D pipeline. As such, the programmable shader of a 3D pipeline is used to provide motion compensated video decoding as opposed to, for example, dedicated hardware, thereby, among other advantages, eliminating the need for the dedicated hardware.

Abstract: A video decoding method and apparatus receives a motion compensation shader command, such as a packet, for a programmable shader of a 3D pipeline, such as programmable vertex shaders and pixel shaders, to provide motion compensation for encoded video, and decode the encoded video using the programmable shader of the 3D pipeline. As such, the programmable shader of a 3D pipeline is used to provide motion compensated video decoding as opposed to, for example, dedicated hardware, thereby, among other advantages, eliminating the need for the dedicated hardware.

Abstract: Metal hydrides are activated by an electrochemical procedure. In this procedure, a bulk sample of the corresponding metal is immersed in an aqueous electrolyte and contacted by a cathode. Current passed through the aqueous electrolyte causes electrolysis of the water and a concomitant reaction with the formation of metal hydride. As a result, the metal hydride is fractured and smaller particles result. Additionally, the resulting metal hydride has a substantial amount of absorbed hydrogen. A novel plating method, taking advantage of the reducing power of hydrogen absorbed in a metal hydride, is useful to encapsulate such metal hydride with a variety of metals. Therefore, such hydrides are uniformly coated by using plating solutions without the standard reducing agent and stabilizer.

Abstract: The thickness uniformity of a plated metal layer inside a via hole can be enhanced by intersecting a conductive via with an insulating aperture before plating. The new via configuration improves the mass transfer of the plating. It is believed that the apertures lower the local solution ohmic resistance near the via holes. The method can be applied to the manufacture of a wide variety of circuit boards.

Abstract: The present invention provides a method for metallizing a ceramic surface comprising a ferrite through a surface reduction treatment. A ceramic surface comprising a ferrite is heated. At least a portion of the ferrite is contacted with a gaseous reducing agent to create a metallic region by removing oxygen from the ferrite. The surface is cooled and, optionally, post-treated to enhance adhesion of the metallic region. Typical gaseous reducing agents are hydrogen, forming gas, and ammonia while typical ferrites are nickel-zinc ferrites and manganese-zinc ferrites. To form patterned regions, portions of the substrate are masked or portions of the reduced layer are removed.

Abstract: A method is described for monitoring the rate at which metal layers are chemically etched. The method involves an indicator layer of metal formed on a surface of a monitor substrate. The thickness of the indicator layer varies according to a wedge-shaped profile along a longitudinal axis. The indicator layer is exposed to an etchant medium for a predetermined duration. During such exposure, a portion of the indicator layer is completely removed, exposing the underlying surface and creating an edge between the exposed surface and the remaining portion of the indicator layer. The etching rate is determined by reference to the longitudinal location of the edge.

Abstract: Transition-metal-coated metallic elements, such as electrical contacts, are protected from corrosion by a novel surface treatment. In one embodiment, the treatment involves application of a phosphonate solution, optionally preceded by application of a chromatic solution phosphonate.

Abstract: An electrical device is provided which has contacts having regions with a conductive matte-finish metal surface. The matte-finish surface is characterized by having a Knoop hardness number of at least 300, a diffuse reflectance of less than about 20 percent, and a specular reflectance of less than about 2 percent. These contacts have a contact resistance of less than about 50 milliohms, under a 50-gram load, even after exposure to 50.degree. C. and 95% relative humidity for a period of 20 days. Reflection electron microscopy shows that particularly advantageous matte-finish surfaces have sharply peaked asperities with average peak angles of less than about 90 degrees. In one embodiment, the surface is formed of hardened nickel electroplated from an electrolytic bath with a pH above about 7.0.

Abstract: A process is described involving gold in which gold cyanide ion (e.g., potassium gold cyanide) is removed from an aqueous solution (typically a water rinse solution) by absorption on an anion-exchange resin and the gold cyanide ion is then removed from the resin using an eluent solution comprising organic solvent, water and thiocyanate ion. This procedure is convenient and leads to virtually complete removal of gold from the resin. Because of the low volume of eluent solution required to remove the gold cyanide ion, the procedure can be used to efficiently produce crystalline potassium gold cyanide from highly dilute aqueous solutions.