Abstract: The invention is directed to a glass composition that can be used to make glass frits suitable for use in the manufacturing of microreactors. The glass compositions, after final sintering to produce a finished microreactor, have a surface crystalline layer of 30 ?m or less, or are completely amorphous throughout. Generally, the borosilicate glasses of the invention have a composition of B2O3=12-22 mol %; SiO2=68-80 mol % and additional components selected from the group consisting of either (a) Al2O3=3-8 mol % and Li2O=1-8 mol %, or (b) K2O=0-2 mol % and Na2O=0-2 mol %, except that both K2O and Na2O cannot both equal zero at the same time. One borosilicate glass has a composition, in mole percent (mol %) of B2O3=18-22 mol %, SiO2=75-80 mol %, K2O=0-2 mol %, and Na2O=0-2 mol %, except that both K2O and Na2O cannot both equal zero at the same time.

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.

Abstract: A hermetically sealed glass package and method for manufacturing the hermetically sealed glass package are described herein using an OLED display as an example. Basically, the hermetically sealed OLED display is manufactured by providing a first substrate plate and a second substrate plate and depositing a frit onto the second substrate plate. OLEDs are deposited on the first substrate plate. An irradiation source (e.g., laser, infrared light) is then used to heat the frit which melts and forms a hermetic seal that connects the first substrate plate to the second substrate plate and also protects the OLEDs. The frit is glass that was doped with at least one transition metal and possibly a CTE lowering filler such that when the irradiation source heats the frit, it softens and forms a bond. This enables the frit to melt and form the hermetic seal while avoiding thermal damage to the OLEDs.