Patents by Inventor Henry I. Kim

Henry I. Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5054681
    Abstract: A tool for desoldering quadrilateral surface-mount components such as integrated circuits which have a row of leads on each of the four sides, the tool comprising a metallic hood with a depending skirt which contacts the rows of leads when the hood is snapped over the component. The hood is heated with a hot air gun or a heating element, and conducts the heat to the leads, melting the solder connecting the leads to the pads of the circuit board, permitting the component to be lifted off of the circuit board.
    Type: Grant
    Filed: July 25, 1990
    Date of Patent: October 8, 1991
    Inventor: Henry I. Kim
  • Patent number: 5024366
    Abstract: A desoldering vat has a central, elongated solder pot which is filled to the brim with solder in use, so that depending component contact pins inserted through and soldered to a circuit board can be immersed in the meniscus of the liquid solder mass to melt the solder and permit removal of the component from the circuit board. A moat is defined around the central solder pot to catch the inevitable spills of solder and permit its replacement into the vat, and multiple adjustable brace bars defined on opposite sides of the central vat are used to support the hands or the circuit board itself while the unit is being used.
    Type: Grant
    Filed: July 25, 1990
    Date of Patent: June 18, 1991
    Inventor: Henry I. Kim
  • Patent number: 4979662
    Abstract: A desoldering vat includes a narrow, elongated, solder pot filled with liquid solder which actually extends slightly above the pot due to the meniscus, and is used to desolder the multiple pins of electronic components, especially elongated components such as edge connectors, which could be as long as 14", with three rows of pins. Adjustable braces on both sides of the pot allow the worker to rest a circuit board against the brace and pot such that the depending pins of the pass-through pins of the components extend into the solder, with the solder in most instances touching the bottom of the printed circuit board. All the pins of the component are thus heated to molten solder temperature at once, permitting the easy removal of the component from the top of the board.
    Type: Grant
    Filed: September 5, 1989
    Date of Patent: December 25, 1990
    Inventor: Henry I. Kim