Abstract: A system and method for creating three-dimensional nanostructures is disclosed. The system includes a substrate bonded to a carrier using a bonding agent. The bonding agent may be vaporizable or sublimable. The carrier may be a glass or glass-like substance. In some embodiments, the carrier may be permeable having one or a plurality of pores through which the bonding agent may escape when converted to a gaseous state with heat, pressure, light or other methods. A substrate is bonded to the carrier using the bonding agent. The substrate is then processed to form a membrane. This processing may include grinding, polishing, etching, patterning, or other steps. The processed membrane is then aligned and affixed to a receiving substrate, or a previously deposited membrane. Once properly attached, the bonding agent is then heated, depressurized or otherwise caused to sublimate or vaporize, thereby releasing the processed membrane from the carrier.

Abstract: A system and method for creating three-dimensional nanostructures is disclosed. The system includes a substrate bonded to a carrier using a bonding agent. The bonding agent may be vaporizable or sublimable. The carrier may be a glass or glass-like substance. In some embodiments, the carrier may be permeable having one or a plurality of pores through which the bonding agent may escape when converted to a gaseous state with heat, pressure, light or other methods. A substrate is bonded to the carrier using the bonding agent. The substrate is then processed to form a membrane. This processing may include grinding, polishing, etching, patterning, or other steps. The processed membrane is then aligned and affixed to a receiving substrate, or a previously deposited membrane. Once properly attached, the bonding agent is then heated, depressurized or otherwise caused to sublimate or vaporize, thereby releasing the processed membrane from the carrier.

Abstract: An imaging system is provided. The imaging system includes a sample to be scanned by the imaging system. An absorbance modulation layer (AML) is positioned in close proximity to the sample and is physically separate from the sample. One or more sub-wavelength apertures are generated within the AML, whose size is determined by the material properties of the AML and the intensities of the illuminating wavelengths. A light source transmits an optical signal through the one or more sub-wavelength apertures generating optical near-fields that are collected for imaging.

Abstract: A structure including a grating and a semiconductor nanocrystal layer on the grating, can be a laser. The semiconductor nanocrystal layer can include a plurality of semiconductor nanocrystals including a Group II-VI compound, the nanocrystals being distributed in a metal oxide matrix. The grating can have a periodicity from 200 nm to 500 nm.

Abstract: A lithography system is disclosed that provides an array of areas of imaging electromagnetic energy that are directed toward a recording medium. The reversible contrast-enhancement material is disposed between the recording medium and the array of areas of imaging electromagnetic energy.

Abstract: A lithography system is disclosed that provides an array of areas of imaging electromagnetic energy that are directed toward a recording medium. The reversible contrast-enhancement material is disposed between the recording medium and the array of areas of imaging electromagnetic energy.

Abstract: A lithography system is disclosed that includes an array of focusing elements for directing focused illumination toward a recording medium, and a reversible contrast-enhancement material disposed between the recording medium and the array of focusing elements.

Abstract: A lithography system is disclosed that includes an array of focusing elements for directing focused illumination toward a recording medium, and a reversible contrast-enhancement material disposed between the recording medium and the array of focusing elements.

Abstract: A structure including a grating and a semiconductor nanocrystal layer on the grating, can be a laser. The semiconductor nanocrystal layer can include a plurality of semiconductor nanocrystals including a Group II-VI compound, the nanocrystals being distributed in a metal oxide matrix. The grating can have a periodicity from 200 nm to 500 nm.

Abstract: A lithography system is disclosed that includes an array of focusing elements for directing focused illumination toward a recording medium, and a reversible contrast-enhancement material disposed between the recording medium and the array of focusing elements.

Abstract: A lithography system is disclosed that provides an array of areas of imaging electromagnetic energy that are directed toward a recording medium. The reversible contrast-enhancement material is disposed between the recording medium and the array of areas of imaging electromagnetic energy.

Abstract: An imaging system is provided. The imaging system includes a sample to be scanned by the imaging system. An absorbance modulation layer (AML) is positioned in close proximity to the sample and is physically separate from the sample. One or more sub-wavelength apertures are generated within the AML, whose size is determined by the material properties of the AML and the intensities of the illuminating wavelengths. A light source transmits an optical signal through the one or more sub-wavelength apertures generating optical near-fields that are collected for imaging.

Abstract: A structure including a grating and a semiconductor nanocrystal layer on the grating, can be a laser. The semiconductor nanocrystal layer can include a plurality of semiconductor nanocrystals including a Group II-VI compound, the nanocrystals being distributed in a metal oxide matrix. The grating can have a periodicity from 200 nm to 500 nm.

Abstract: A method or system of spatial-phase locking a beam used in maskless lithography provides a fiducial grid with a single spatial-period, the fiducial grid being rotated at an angle with respect to a direction of scanning the beam; detects a signal generated in response to the beam being incident upon the fiducial grid; determines frequency components of the detected signal; and determines a two-dimensional location of the beam from phases of two determined fundamental frequency component. The method or system further determines a size of the beam from relative amplitudes of the determined fundamental and harmonic frequency components and/or determine a shape of the beam from relative amplitudes of the determined fundamental and harmonic frequency components. The method or system corrects a deflection of the beam in response to the determined two-dimensional location, and/or adjusts the size of the beam in response to the determined size, and/or adjusts the shape of the beam in response to the determined shape.

Abstract: A maskless lithography system is disclosed that includes a spatial light modulator, first and second imaging areas, and first folding optics. The spatial light modulator receives illumination from an illumination source and provides a modulated illumination beam having a first cross-sectional line length in a length-wise direction and a first cross-sectional width in a width-wise direction that is substantially smaller than said first cross-sectional length. The first imaging area receives a first portion of the modulated illumination beam. The first folding optics provides a second portion of the modulated illumination beam that is adjacent the first portion of the modulated illumination beam in the length-wise direction at a second imaging area that is not adjacent the first imaging area in the length-wise direction.

Abstract: A method is disclosed for forming an array of focusing elements for use in a lithography system. The method involves varying an exposure characteristic over an area to create a focusing element that varies in thickness in certain embodiments. In further embodiments, the method includes the steps of providing a first pattern via lithography in a substrate, depositing a conductive absorber material on the substrate, applying an electrical potential to at least a first portion of the conductive absorber material, leaving a second portion of the conductive material without the electrical potential, and etching the second portion of the conductive material to provide a first pattern on the substrate that is aligned with the first portion of the conductive absorber material.

Abstract: A micro-fabricated structure and method of forming a micro-fabricated structure are disclosed. The method includes the steps of forming a first pattern in a first photo-resist, transferring the first pattern in the first photo-resist to a mask layer, forming a second pattern in a second photo-resist, and transferring the second pattern in the second photo-resist to the mask layer. In various embodiments, the method may further include the steps of forming a first pattern in a first photo-resist, forming a second pattern in a second photo-resist, and transferring the first and second patterns to a target layer.

Abstract: A method is disclosed for creating a permanent pattern on a substrate. The method includes the steps of providing an array of photon sources, each of which provides a photon beam, providing an array of focusing elements, each of which focuses an associated photon beam from the array of photon sources onto a substrate, and creating a permanent pattern on a substrate using the array of focusing elements to respectively focus associated photon beams on the substrate.

Abstract: An optical manipulation system is disclosed that includes an array of focusing elements, which focuses the energy beamlets from an array of beamlet sources into an array of focal spots in order to individually manipulate a plurality of samples on an adjacent substrate.

Abstract: A method is disclosed for forming an array of focusing elements for use in a lithography system. In accordance with an embodiment, the method includes the steps of providing a master element that includes at least one diffractive pattern at a first location with respect to a target surface, illuminating the master element to produce a first diffractive pattern on the target surface at the first location, moving the master element with respect to the target surface to a second location with respect to the target surface, and illuminating the master element to produce a second diffractive pattern on the target surface at the second location.