Patents by Inventor Henry J. H. Chen

Henry J. H. Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method of a condenser microphone
    Patent number: 9729990
    Abstract: A condenser microphone comprises a substrate, a vibratile diaphragm and a back plate. The substrate has an opening. The diaphragm is disposed corresponding to the substrate and covers the opening, and has a plurality of protrusions. The back plate is coupled to the diaphragm and has a plurality of through holes, at least some of which are corresponding to the protrusions respectively. An interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: August 8, 2017
    Assignee: National Tsing Hua University
    Inventors: Sun-Zen Chen, Henry J. H. Chen, Jen-Yi Chen, Kuan-Hsun Chiu, Kuang-Chien Hsieh
  • CONDENSER MICROPHONE AND MANUFACTURING METHOD THEREOF
    Publication number: 20160112818
    Abstract: A condenser microphone comprises a substrate, a vibratile diaphragm and a back plate. The substrate has an opening. The diaphragm is disposed corresponding to the substrate and covers the opening, and has a plurality of protrusions. The back plate is coupled to the diaphragm and has a plurality of through holes, at least some of which are corresponding to the protrusions respectively. An interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes.
    Type: Application
    Filed: December 22, 2015
    Publication date: April 21, 2016
    Inventors: Sun-Zen Chen, Henry J. H. Chen, Jen-Yi Chen, Kuan-Hsun Chiu, Kuang-Chien Hsieh
  • Condenser microphone and manufacturing method thereof
    Patent number: 9258662
    Abstract: A condenser microphone comprises a substrate, a vibratile diaphragm and a back plate. The substrate has an opening. The diaphragm is disposed corresponding to the substrate and covers the opening, and has a plurality of protrusions. The back plate is coupled to the diaphragm and has a plurality of through holes, at least some of which are corresponding to the protrusions respectively. An interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes.
    Type: Grant
    Filed: February 18, 2014
    Date of Patent: February 9, 2016
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Sun-Zen Chen, Henry J. H Chen, Jen-Yi Chen, Kuan-Hsun Chiu, Kuang-Chien Hsieh
  • CONDENSER MICROPHONE AND MANUFACTURING METHOD THEREOF
    Publication number: 20140233767
    Abstract: A condenser microphone comprises a substrate, a vibratile diaphragm and a back plate. The substrate has an opening. The diaphragm is disposed corresponding to the substrate and covers the opening, and has a plurality of protrusions. The back plate is coupled to the diaphragm and has a plurality of through holes, at least some of which are corresponding to the protrusions respectively. An interval is formed between the diaphragm and the back plate, and when the diaphragm vibrates, the protrusions move into or further near the through holes.
    Type: Application
    Filed: February 18, 2014
    Publication date: August 21, 2014
    Applicant: National Tsing Hua University
    Inventors: Sun-Zen CHEN, Henry J.H CHEN, Jen-Yi CHEN, Kuan-Hsun CHIU, Kuang-Chien HSIEH
  • HEATING SPREADING ELEMENT WITH ALN FILM AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20120127659
    Abstract: The present invention relates to a heat spreading element with an AlN film including: a substrate which may be composed of a single bulk material, a multi-layered sample, or a composite material; and an AlN film deposited on the surface of the substrate, wherein the thickness of the AlN film is in a range of 1 nm to 10 ?m, and the AlN film is used to conduct the heat from a heat-generating device to the substrate, and method for manufacturing the same.
    Type: Application
    Filed: August 2, 2011
    Publication date: May 24, 2012
    Inventors: SunZen CHEN, Puru Lin, Henry J. H. Chen