Abstract: A controlled impedance interconnection assembly (50), for connecting an x-band coaxial connector (66) to a microstrip (60) on a circuit board (52), comprises a circuit board having a core (54) of dielectric material terminated by first and second surfaces (56, 58). An electrically conductive microstrip (60) and electrically conductive material (62) are adhered respectively to the first and second surfaces, and a hole (64), substantially at right angles to the surfaces, extends through the core and the conductive material on the second surface, and to the conductive microstrip on the first surface. The x-band coaxial connector, including an inner conductor (68) and a conductive shell (70) coaxially surrounding the inner conductor, is secured at right angles to the circuit board.

Abstract: A jig (10 is provided for testing high speed integrated circuit devices (52). The jig includes a lead guide (50) for automatically aligning the IC leads (54) with the signal carrying traces (22). The underside of the jig is provided with a grounded pad (30) that enables leadless external components (86) to be easily connected to given leads of the IC under test.

Abstract: Ground shield apparatus for improving a test jig apparatus (10) is disclosed for providing accurate and reliable evaluation of a wide variety of test devices which propagate signals having frequencies in excess of one gigahertz over a broad range of temperatures. A circular ground wall (12) encloses a multi-layer arrangement of disc-shaped dielectric layers (18, 22) which both enclose and are attached to a conductive ground plane (20). Plated-through holes (26) are deployed at the periphery of each of the discs (18, 20, 22) in order to electrically couple upper and lower ground rings (24, 25) to the ground wall (12) and the ground plane (20). External jig connectors (16) are mounted in connector holes (14) formed in the ground wall (12).

Abstract: Gigahertz test jig apparatus (10) is disclosed for providing accurate and reliable evaluation of a wide variety of test devices which propagate signals having frequencies in excess of one gigahertz over a broad range of temperatures. A circular ground wall (12) encloses a multi-layer arrangement of disc-shaped dielectric layers (18, 22) which both enclose and are attached to a conductive ground plane (20). Plated-through holes (26) are deployed at the periphery of each of the discs (18, 20, 22) in order to electrically coupled upper and lower ground rings (24, 25) to the ground wall (12) and the ground plane (20). External jig connectors (16) are mounted in connector holes (14) formed in the ground wall (12). Conductive signal traces (30A, 30B) are etched on the exterior faces of the dielectric discs (18, 22) and are joined to the external jig connectors (16) and test device pin terminals (28) which are arranged to receive and hold a test device (36) such as an integrated circuit.