Abstract: A monitoring unit to support a medical workflow for examining a patient, comprises: a base body including multiple attachment slots; multiple sensor units, each of the multiple sensor units being attached to one of the multiple attachment slots and/or permanently fixed to the base body, at least one of the multiple sensor units being configured to collect patient related data, and at least one of the multiple sensor units being configured to collect environmental data. A computing device is configured to: process the patient related data and the environmental data; create output data based on the patient related data and/or the environmental data; and initiate output of the output data via an output device, the output device being configured to receive the output data from the computing device and to output the output data.

Abstract: Provided are a method of generating a resulting image as if drawn by an artist and an apparatus for executing the method. The apparatus includes a first generation unit configured to generate a vector field expressing a shape of an image using feature pixels of the image captured by an image device and direction information of the feature pixels, a second generation unit configured to generate a structure grid indicating a structure for rendering the shape of the image using the vector field, and a rendering unit configured to render primitives expressing predetermined tones on the generated structure grid. Accordingly, it is possible to automatically and rapidly generate a resulting image from one image. Anyone can easily generate a hedcut from one photo without the limitation that a limited number of artists need to invest a great deal of time to complete one hedcut.

Abstract: A method for adhesive stacking includes dispensing a first line of adhesive onto a first substrate; dispensing at least one additional line of adhesive stacked onto the first line of adhesive; and placing a second substrate onto the at least one additional line of adhesive to join the first and second substrates.

Abstract: In an embodiment, a fluid ejection device includes a die including a fluid feed slot that extends from a back side to a front side of the die, a firing chamber formed on the front side to receive fluid from the feed slot, a fluid distribution manifold adhered to the back side to provide fluid to the feed slot, and a corrosion-resistant layer coating the back side of the die so as not to extend into the feed slot.

Abstract: In an embodiment, a fluid ejection device includes a die including a fluid feed slot that extends from a back side to a front side of the die, a firing chamber formed on the front side to receive fluid from the feed slot, a fluid distribution manifold adhered to the back side to provide fluid to the feed slot, and a corrosion-resistant layer coating the back side of the die so as not to extend into the feed slot.

Abstract: A method for adhesive stacking includes dispensing a first line of adhesive onto a first substrate; dispensing at least one additional line of adhesive stacked onto the first line of adhesive; and placing a second substrate onto the at least one additional line of adhesive to join the first and second substrates.

Abstract: A micro electro-mechanical system (MEMS) device includes an electrical wafer, a mechanical wafer, a plasma treated oxide seal bonding the electrical wafer to the mechanical wafer, and an electrical interconnect between the electrical wafer and the mechanical wafer.

Abstract: A packaged micro-electromechanical systems (MEMS) device assembly includes a MEMS device, a substrate within which the MEMS device is disposed, and a lid disposed over the substrate. The assembly may include one or more first cavities within the lid having a predetermined volume satisfying packaging specifications for the packaged MEMS device assembly. The assembly may include one or more second cavities within the lid and one or more corresponding overflow areas within the lid, where each second cavity contains a material and each corresponding overflow area is adapted to catch overflow of the material. The assembly may include one or more third cavities within the lid and one or more channels within one of the substrate and the lid to fluidically connect the MEMS device to the third cavities.

Abstract: In one embodiment, a package for a micro-device includes a substrate, a transparent material covering the substrate, and a bond ring bonding the transparent material to the substrate. The bond ring comprises a silicon oxide layer on one of the substrate or the transparent material bonded to a silicon layer on the other of the substrate or the transparent material.

Abstract: A packaged micro-electromechanical systems (MEMS) device assembly includes a MEMS device, a substrate within which the MEMS device is disposed, and a lid disposed over the substrate. The assembly may include one or more first cavities within the lid having a predetermined volume satisfying packaging specifications for the packaged MEMS device assembly. The assembly may include one or more second cavities within the lid and one or more corresponding overflow areas within the lid, where each second cavity contains a material and each corresponding overflow area is adapted to catch overflow of the material. The assembly may include one or more third cavities within the lid and one or more channels within one of the substrate and the lid to fluidically connect the MEMS device to the third cavities.

Abstract: A micro electro-mechanical system (MEMS) device includes an electrical wafer, a mechanical wafer, a plasma treated oxide seal bonding the electrical wafer to the mechanical wafer, and an electrical interconnect between the electrical wafer and the mechanical wafer.

Abstract: In one embodiment, a package for a micro-device includes a substrate, a transparent material covering the substrate, and a bond ring bonding the transparent material to the substrate. The bond ring comprises a silicon oxide layer on one of the substrate or the transparent material bonded to a silicon layer on the other of the substrate or the transparent material.

Abstract: A method of manufacturing photonic band gap structures operable in the optical spectrum has been presented. The method comprises the steps of creating a patterned template for an elastomeric mold, fabricating an elastomeric mold from poly-dimethylsiloxane (PDMS) or other suitable polymer, filling the elastomeric mold with a second polymer such as epoxy or other suitable polymer, stamping the second polymer by making contact with a substrate or multilayer structure, removing the elastomeric mold, infiltrating the multilayer structure with ceramic or metal, and heating the multilayer structure to remove the second polymer to form a photonic band gap structure.