Abstract: A leadframe loader having a magnetic latch of predefined strength connecting a drive arm mechanism and a pusher system is the preferred embodiment of a transport loader. The amount of force applied to a pusher blade is set to a level below that where a leadframe, or other device to be pushed would be damaged by selecting the size and strength of a magnetic latch attached to the drive arm. The magnet is designed to break away from the steel coupling structure on the pusher when the force exceeds a preset value, and stops the movement before damage to the leadframe occurs. Calculated values were verified by physical testing, and a safety margin assigned to insure release of the magnet prior to bending leadframes. The system is assimilated into different pieces of semiconductor assembly equipment.

Abstract: A leadframe loader having a magnetic latch of predefined strength connecting a drive arm mechanism and a pusher system is the preferred embodiment of a transport loader. The amount of force applied to a pusher blade is set to a level below that where a leadframe, or other device to be pushed would be damaged by selecting the size and strength of a magnetic latch attached to the drive arm. The magnet is designed to break away from the steel coupling structure on the pusher when the force exceeds a preset value, and stops the movement before damage to the leadframe occurs. Calculated values were verified by physical testing, and a safety margin assigned to insure release of the magnet prior to bending leadframes. The system is assimilated into different pieces of semiconductor assembly equipment.

Abstract: A method of bonding wires which includes providing at least a first and second pair of bonding locations, one of each pair of bonding locations being subject to flexure in response to the application of a force thereagainst. A clamping force is applied against at least one of the bonding locations subject to flexure and a wire bond is formed to the first bonding locations subject to flexure. The clamping force is removed from the first bonding location subject to flexure and a clamping force is applied against the second of the bonding locations subject to flexure. A wire bond is formed to the second of the bonding locations subject to flexure and the clamping force is removed from the second of the bonding locations subject to flexure.

Abstract: A wire bond station has a platform (32) in cavity (31) of the work station heater block (30) on which a lead frame die mount pad (33) is placed during wire bonding to semiconductor chip mounted on the die mount pad. The platform (32) is of a dimension such that the edges of the die mount pad (33) extend out from the platform (32) so that irregularities (34) on the edges of the die mount pad (33) do not support the die mount pad (33) above the platform (32).

Abstract: A wire bonder for bonding semiconductor packages that require a deep access to bond between the semiconductor device bond pads and the bonding area on the package to avoid interference between the bond head and the package pins, the bonder including a bellows actuated wire clamp, a reverse venturi to remove slack from the bonding wire, and a lengthened bonding tool.