Patents by Inventor Henry Lum, Jr.

Henry Lum, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6756095
    Abstract: This invention relates to a heat-sealable laminate, comprising: a facestock having an upper surface and a lower surface; a heat-activatable first adhesive layer underlying the lower surface of the facestock; and a second adhesive layer overlying the upper surface of the facestock, with the proviso that the laminate is characterized by the absence of either an adhesion promoting layer or an abrasion-resistant transparent coating layer positioned between the upper surface of the facestock and the second adhesive layer. These heat-sealable laminates may be used in providing pictorial and/or print designs or messages (e.g., labels, decals, etc.) that can be adhered to substrates (e.g., metal, plastic, leather, paper or textile substrates) such as automotive interior surfaces, hard plastic component parts, consumer durable goods, and the like.
    Type: Grant
    Filed: January 10, 2001
    Date of Patent: June 29, 2004
    Assignee: Avery Dennison Corporation
    Inventors: Richard L. Sandt, Mark D. Kittel, Henry Lum, Jr.
  • Patent number: 5252662
    Abstract: A low viscosity hot melt acrylic pressure sensitive adhesive polymer is formed by bulk polymerization of at least one alkyl acrylate monomer containing from about 4 to 8 carbon atoms in the alkyl group and present in an amount of from about 60 to about 95% by weight of the polymer, from 1 to about 10% by weight of a copolymerizable amide monomer, from 1 to 10% by weight of a copolymerizble carboxylic acid, and a positive amount up to about 6% by weight of the monomers of a copolymerizable anhydride, said polymer formed thermally reversible crosslinks with a metal cation having a valence of from 2 to 4. Viscosity of the polymer is typically from 2 to 8 Pa.s at 150.degree. C. as formed and increases up to 100 Pa.s at 150.degree. C. on addition of the metal cation.
    Type: Grant
    Filed: September 25, 1992
    Date of Patent: October 12, 1993
    Assignee: Avery Dennison Corporation
    Inventors: Shiaonung Su, Yehuda Ozari, Richard R. Vargas, Henry Lum, Jr.