Patents by Inventor Henry Meyer Daghighian
Henry Meyer Daghighian has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 11688821Abstract: In an example, a wireless gamma and or hard X-ray radiation detector includes a bulk semiconductor crystal, electrical contacts, a bias circuit, and a terahertz (THz) electromagnetic (EM) wave receiver. The bulk semiconductor crystal and includes indium antimonide (InSb), cadmium telluride (CdTe), or cadmium zinc telluride (CdZnTe). The electrical contacts are coupled to two facets of the bulk semiconductor crystal. The bias circuit is electrically coupled to the bulk semiconductor crystal through the electrical contacts. The THz EM wave receiver is positioned to detect THz radiation emitted by the bulk semiconductor crystal.Type: GrantFiled: September 29, 2021Date of Patent: June 27, 2023Inventor: Henry Meyer Daghighian
-
Publication number: 20230041758Abstract: In an example, a wireless gamma and or hard X-ray radiation detector includes a bulk semiconductor crystal, electrical contacts, a bias circuit, and a terahertz (THz) electromagnetic (EM) wave receiver. The bulk semiconductor crystal and includes indium antimonide (InSb), cadmium telluride (CdTe), or cadmium zinc telluride (CdZnTe). The electrical contacts are coupled to two facets of the bulk semiconductor crystal. The bias circuit is electrically coupled to the bulk semiconductor crystal through the electrical contacts. The THz EM wave receiver is positioned to detect THz radiation emitted by the bulk semiconductor crystal.Type: ApplicationFiled: September 29, 2021Publication date: February 9, 2023Inventor: Henry Meyer Daghighian
-
Patent number: 11271657Abstract: An apparatus and method for signaling and transmitting data through an optical link is described. The apparatus may include a connector including a first plurality of contacts compatible with an enhanced SFP (SFP+) connector. The connector further includes an additional contact formed at a space adjacent to the first plurality of contacts. A tone generator couples to the additional contact to receive a first signal and to generate a first distinct tone indicative of the first signal for transmission via the additional contact. The method may include generating a first distinct tone indicative of a first signal providing control or status of an apparatus and transmitting or receiving a differential data signal over a portion of a first plurality of contacts compatible with an enhanced SFP (SFP+) connector. The first distinct tone is transmitted over the additional contact formed in a space adjacent to the first plurality of contacts.Type: GrantFiled: November 19, 2018Date of Patent: March 8, 2022Assignee: II-VI DELAWARE, INC.Inventors: Giuliano Coli, Stephen Nelson, Henry Meyer Daghighian
-
Patent number: 11057984Abstract: A circuit includes a printed circuit board including a first portion defining a window formed as a first void on a first side of the printed circuit board and a second portion defining a cavity formed as a second void opposite the first void on a second side of the printed circuit board. The circuit further includes a heat sink inserted in the second void, the heat sink having a first side forming a bottom of the first void and the bottom of the first void within the printed circuit board. The circuit yet further includes at least one electronic circuit die mounted to the first side of the heat sink and electrically coupled to the first side of the printed circuit board.Type: GrantFiled: November 26, 2018Date of Patent: July 6, 2021Assignee: II-VI DELAWARE, INC.Inventors: Steven C. Bird, Henry Meyer Daghighian
-
Patent number: 10667388Abstract: An optical waveguide is disclosed. In a disclosed embodiment, the optical waveguide includes a first aluminum nitride (AlN) thin film disposed on a layer of high-frequency polymer. A second AlN thin film is embedded in the first AlN thin film. In disclosed embodiments, the nitrogen concentration level of the first AlN thin film is different than the concentration level of the second AlN thin film.Type: GrantFiled: November 4, 2019Date of Patent: May 26, 2020Assignee: II-VI Delaware Inc.Inventors: Henry Meyer Daghighian, Steven C. Bird
-
Patent number: 10628297Abstract: Embodiments of a device and method to automatically acquire signal quality metrics in a digital communication system are disclosed. The device may include acquisition means to sample the likelihood of a digital communication signal passing through a grid of time and amplitude regions, and storage means by which such likelihood measurements may be accumulated in a computer memory array for analysis. A state machine may execute a method that controls both the acquisition means and the storage means, requiring minimal intervention from supervisory systems.Type: GrantFiled: December 26, 2017Date of Patent: April 21, 2020Assignee: Finisar CorporationInventors: Henry Meyer Daghighian, Lucy G. Hosking, Gilles P. Denoyer
-
Publication number: 20200068706Abstract: An optical waveguide is disclosed. In a disclosed embodiment, the optical waveguide includes a first aluminum nitride (AlN) thin film disposed on a layer of high-frequency polymer. A second AlN thin film is embedded in the first AlN thin film. In disclosed embodiments, the nitrogen concentration level of the first AlN thin film is different than the concentration level of the second AlN thin film.Type: ApplicationFiled: November 4, 2019Publication date: February 27, 2020Inventors: Henry Meyer Daghighian, Steven C. Bird
-
Patent number: 10470302Abstract: A printed circuit board may include an aluminum nitride (AIN) substrate that includes an AIN thin film and a layer of high-frequency polymer as a carrier substrate of the AIN thin film. The AIN substrate forms a first layer of the printed circuit board. The AIN substrate comprises a heat spreader that laterally spreads out heat from a heat sink on the printed circuit board to form a thermal dissipation path parallel with a signal path on the printed circuit board. The printed circuit board may include a main substrate aligned to and bonded with the AIN substrate. The main substrate may include one or more additional layers of the printed circuit board.Type: GrantFiled: April 25, 2016Date of Patent: November 5, 2019Assignee: Finisar CorporationInventors: Henry Meyer Daghighian, Steven C. Bird
-
Publication number: 20190166684Abstract: A circuit includes a printed circuit board including a first portion defining a window formed as a first void on a first side of the printed circuit board and a second portion defining a cavity formed as a second void opposite the first void on a second side of the printed circuit board. The circuit further includes a heat sink inserted in the second void, the heat sink having a first side forming a bottom of the first void and the bottom of the first void within the printed circuit board. The circuit yet further includes at least one electronic circuit die mounted to the first side of the heat sink and electrically coupled to the first side of the printed circuit board.Type: ApplicationFiled: November 26, 2018Publication date: May 30, 2019Inventors: Steven C. Bird, Henry Meyer Daghighian
-
Publication number: 20190164891Abstract: A circuit of tunable differential vias may include a first tunable via circuit configured to couple a first signal of a differential signal pair from a first outer surface of a printed circuit board (PCB) to a second outer surface of the PCB. The circuit may further include a second tunable via circuit configured to couple a second signal of the differential signal pair from the first outer surface of the PCB to the second outer surface of the PCB. The first tunable via circuit may further include a first buried via spatially offset from the second tunable via circuit to cause a predetermined impedance for the first and second signals through the first and second tunable via circuits at an operating frequency.Type: ApplicationFiled: November 27, 2017Publication date: May 30, 2019Inventors: Steven C. Bird, Ron Greenlaw, Henry Meyer Daghighian
-
Publication number: 20190132053Abstract: An apparatus and method for signaling and transmitting data through an optical link is described. The apparatus may include a connector including a first plurality of contacts compatible with an enhanced SFP (SFP+) connector. The connector further includes an additional contact formed at a space adjacent to the first plurality of contacts. A tone generator couples to the additional contact to receive a first signal and to generate a first distinct tone indicative of the first signal for transmission via the additional contact. The method may include generating a first distinct tone indicative of a first signal providing control or status of an apparatus and transmitting or receiving a differential data signal over a portion of a first plurality of contacts compatible with an enhanced SFP (SFP+) connector. The first distinct tone is transmitted over the additional contact formed in a space adjacent to the first plurality of contacts.Type: ApplicationFiled: November 19, 2018Publication date: May 2, 2019Inventors: Giuliano Coli, Stephen Nelson, Henry Meyer Daghighian
-
Patent number: 10135538Abstract: An apparatus and method for signaling and transmitting data through an optical link is described. The apparatus may include a connector including a first plurality of contacts compatible with an enhanced SFP (SFP+) connector. The connector further includes an additional contact formed at a space adjacent to the first plurality of contacts. A tone generator couples to the additional contact to receive a first signal and to generate a first distinct tone indicative of the first signal for transmission via the additional contact. The method may include generating a first distinct tone indicative of a first signal providing control or status of an apparatus and transmitting or receiving a differential data signal over a portion of a first plurality of contacts compatible with an enhanced SFP (SFP+) connector. The first distinct tone is transmitted over the additional contact formed in a space adjacent to the first plurality of contacts.Type: GrantFiled: July 13, 2017Date of Patent: November 20, 2018Assignee: Finisar CorporationInventors: Giuliano Coli, Stephen Nelson, Henry Meyer Daghighian
-
Patent number: 10111343Abstract: Some embodiments relate to micro vias in printed circuit boards (PCBs). In an example, a PCB may include a PCB substrate and a micro via. The micro via may extend between opposing surfaces of the PCB substrate and may have a diameter less than or equal to about 100 microns. In another example, a method of forming micro vias in a PCB may include forming a through hole in a PCB substrate of the PCB. The method may also include positioning a pillar that is electrically conductive within the through hole. The method may also include backfilling the through hole around the pillar with an epoxy backfill.Type: GrantFiled: November 11, 2014Date of Patent: October 23, 2018Assignee: FINISAR CORPORATIONInventors: Henry Meyer Daghighian, Steven C. Bird, YongShan Zhang
-
Publication number: 20180121342Abstract: Embodiments of a device and method to automatically acquire signal quality metrics in a digital communication system are disclosed. The device may include acquisition means to sample the likelihood of a digital communication signal passing through a grid of time and amplitude regions, and storage means by which such likelihood measurements may be accumulated in a computer memory array for analysis. A state machine may execute a method that controls both the acquisition means and the storage means, requiring minimal intervention from supervisory systems.Type: ApplicationFiled: December 26, 2017Publication date: May 3, 2018Inventors: Henry Meyer Daghighian, Lucy G. Hosking, Gilles P. Denoyer
-
Publication number: 20180041283Abstract: An apparatus and method for signaling and transmitting data through an optical link is described. The apparatus may include a connector including a first plurality of contacts compatible with an enhanced SFP (SFP+) connector. The connector further includes an additional contact formed at a space adjacent to the first plurality of contacts. A tone generator couples to the additional contact to receive a first signal and to generate a first distinct tone indicative of the first signal for transmission via the additional contact. The method may include generating a first distinct tone indicative of a first signal providing control or status of an apparatus and transmitting or receiving a differential data signal over a portion of a first plurality of contacts compatible with an enhanced SFP (SFP+) connector. The first distinct tone is transmitted over the additional contact formed in a space adjacent to the first plurality of contacts.Type: ApplicationFiled: July 13, 2017Publication date: February 8, 2018Inventors: Giuliano Coli, Stephen Nelson, Henry Meyer Daghighian
-
Patent number: 9852057Abstract: Embodiments of a device and method to automatically acquire signal quality metrics in a digital communication system are disclosed. The device may include acquisition means to sample the likelihood of a digital communication signal passing through a grid of time and amplitude regions, and storage means by which such likelihood measurements may be accumulated in a computer memory array for analysis. A state machine may execute a method that controls both the acquisition means and the storage means, requiring minimal intervention from supervisory systems.Type: GrantFiled: June 24, 2015Date of Patent: December 26, 2017Assignee: Finisar CorporationInventors: Henry Meyer Daghighian, Lucy G. Hosking, Gilles P. Denoyer
-
Patent number: 9686862Abstract: A capacitor in a multilayer printed circuit board is described. The capacitor may include a via of a via-in-pad type and a dielectric mixture filled in the via of the via-in-pad type. The via may be disposed under an integrated circuit contact pad of the multilayer printed circuit board. The dielectric mixture may include a nanoparticle-sized dielectric powder mixed with an adhesive material.Type: GrantFiled: September 18, 2015Date of Patent: June 20, 2017Assignee: FINISAR CORPORATIONInventor: Henry Meyer Daghighian
-
Publication number: 20160378132Abstract: Embodiments of a device and method to automatically acquire signal quality metrics in a digital communication system are disclosed. The device may include acquisition means to sample the likelihood of a digital communication signal passing through a grid of time and amplitude regions, and storage means by which such likelihood measurements may be accumulated in a computer memory array for analysis. A state machine may execute a method that controls both the acquisition means and the storage means, requiring minimal intervention from supervisory systems.Type: ApplicationFiled: June 24, 2015Publication date: December 29, 2016Inventors: Henry Meyer Daghighian, Lucy G. Hosking, Gilles P. Denoyer
-
Patent number: 9526185Abstract: A hybrid printed circuit board may include a top layer, a bottom layer, and a plurality of internal layers stacked up between the top layer and the bottom layer. The plurality of internal layers may include a first internal layer below the top layer and a second internal layer above the bottom layer. The hybrid printed circuit board may include first unreinforced laminate placed between the top layer and the first internal layer. The hybrid circuit board may additionally include second unreinforced laminate placed between the second internal layer and the bottom layer. The hybrid printed circuit board may include third laminate placed between adjacent internal layers of the plurality of internal layers.Type: GrantFiled: April 8, 2014Date of Patent: December 20, 2016Assignee: FINISAR CORPORATIONInventors: Henry Meyer Daghighian, Steven C. Bird, Gerald Douglas Babel
-
Publication number: 20160323992Abstract: A printed circuit board may include an aluminum nitride (AIN) substrate that includes an AIN thin film and a layer of high-frequency polymer as a carrier substrate of the AIN thin film. The AIN substrate forms a first layer of the printed circuit board. The AIN substrate comprises a heat spreader that laterally spreads out heat from a heat sink on the printed circuit board to form a thermal dissipation path parallel with a signal path on the printed circuit board. The printed circuit board may include a main substrate aligned to and bonded with the AIN substrate. The main substrate may include one or more additional layers of the printed circuit board.Type: ApplicationFiled: April 25, 2016Publication date: November 3, 2016Inventors: Henry Meyer Daghighian, Steven C. Bird