Patents by Inventor Henry Nignardot

Henry Nignardot has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High adherence copper plating process
    Patent number: 5246565
    Abstract: A process for applying copper to a substrate of aluminum or steel by electrodeposition and for preparing an aluminum or steel substrate for electrodeposition of copper. Practice of the invention provides good adhesion of the copper layer to the substrate.
    Type: Grant
    Filed: May 7, 1992
    Date of Patent: September 21, 1993
    Assignee: The United States of America as represented by the United States Department of Energy
    Inventor: Henry Nignardot