Abstract: Disclosed is a moisture curable hot melt adhesive composition that includes a polyurethane prepolymer that includes the reaction product of an amorphous polyester polyol having a solubility parameter of at least 9.8 (cal/cm3)1/2 and a glass transition temperature no greater than 25° C., at least 10% by weight of a crystalline polyester polyol having a melting point of at least 75° C., and polyisocyanate.

Abstract: Disclosed is an article that includes a first substrate, a second substrate, and a re-workable adhesive composition, the first substrate being bonded to the second substrate through the adhesive composition. The adhesive composition is derived from a moisture curable polyurethane hot melt adhesive composition that includes a polyurethane prepolymer that includes the reaction product of a first crystalline polyester polyol having a number average molecular weight of from at least 5500 grams per mole (g/mol) to about 20,000 g/mol and a melting point of at least 40° C., and a polyisocyanate. The re-workable adhesive composition is cleanly removable from at least one of the first substrate and the second substrate after conditioning the article at a temperature of from at least 60° C. to no greater than 100° C. for a period of about 30 minutes.

Abstract: Disclosed is an electronic article that includes a first substrate, a moisture cured polyurethane hot melt adhesive composition, a second substrate bonded to the first substrate through the cured adhesive composition, and an electrically conductive element, the cured adhesive composition being derived from at least 15% by weight amorphous polyester polyol having a number average molecular weight of from about 500 grams per mole to about 10,000 grams per mole and a glass transition temperature no greater than 0° C., and including aromatic units, at least 15% by weight crystalline polyester polyol having a glass transition temperature of no greater than 20° C., a melting point of from about 40° C. to about 120° C., and a number average molecular weight of from about 2000 grams per mole to about 20,000 grams per mole, and polyisocyanate. Prior to cure, the adhesive composition exhibits a viscosity no greater than 10,000 centipoise at 120° C.

Abstract: Disclosed is an article that includes a first substrate, a second substrate, and a re-workable adhesive composition, the first substrate being bonded to the second substrate through the adhesive composition. The adhesive composition is derived from a moisture curable polyurethane hot melt adhesive composition that includes a polyurethane prepolymer that includes the reaction product of a first crystalline polyester polyol having a number average molecular weight of from at least 5500 grams per mole (g/mol) to about 20,000 g/mol and a melting point of at least 40° C., and a polyisocyanate. The re-workable adhesive composition is cleanly removable from at least one of the first substrate and the second substrate after conditioning the article at a temperature of from at least 60° C. to no greater than 100° C. for a period of about 30 minutes.

Abstract: Disclosed is an article that includes a first substrate, a second substrate, and a re-workable adhesive composition, the first substrate being bonded to the second substrate through the adhesive composition. The adhesive composition is derived from a moisture curable polyurethane hot melt adhesive composition that includes a polyurethane prepolymer that includes the reaction product of a first crystalline polyester polyol having a number average molecular weight of from at least 5500 grams per mole (g/mol) to about 20,000 g/mol and a melting point of at least 40° C., and a polyisocyanate. The re-workable adhesive composition is cleanly removable from at least one of the first substrate and the second substrate after conditioning the article at a temperature of from at least 60° C. to no greater than 100° C. for a period of about 30 minutes.