Patents by Inventor Henry Paul S. Cervantes

Henry Paul S. Cervantes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Assembly and method for sealing a bundle of wires
    Patent number: 11843232
    Abstract: A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: December 12, 2023
    Inventors: Vijay Daga, Jaydip Das, Kavitha Bharadwaj, Ting Gao, Quentin Francis Polosky, Henry Paul S. Cervantes
  • ASSEMBLY AND METHOD FOR SEALING A BUNDLE OF WIRES
    Publication number: 20220115848
    Abstract: A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.
    Type: Application
    Filed: December 20, 2021
    Publication date: April 14, 2022
    Inventors: Vijay DAGA, Jaydip DAS, Kavitha BHARADWAJ, Ting GAO, Quentin Francis POLOSKY, Henry Paul S. CERVANTES
  • Assembly and method for sealing a bundle of wires
    Patent number: 11239639
    Abstract: A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: February 1, 2022
    Assignee: TE Connectivity Services GMBH
    Inventors: Vijay Daga, Jaydip Das, Kavitha Bharadwaj, Ting Gao, Quentin F. Polosky, Henry Paul S. Cervantes
  • Assembly and Method for Sealing a Bundle of Wires
    Publication number: 20180097344
    Abstract: A sealing assembly for sealing a bundle of wires includes a first sheet formed of a sealant material, a second sheet disposed above the first sheet, and a third sheet disposed above the second sheet formed of the sealant material. The second sheet includes a thermally conductive material. When the bundle of wires is overlaid on the assembly in a first direction, and the assembly is wrapped in a second direction that is generally perpendicular to the first to thereby surround the wires, the second sheet facilitates enhanced thermal energy distribution of applied heat throughout the assembly to thereby more uniformly melt the sealant material and thereby fill voids between the wires.
    Type: Application
    Filed: September 30, 2016
    Publication date: April 5, 2018
    Inventors: Vijay Daga, Jaydip Das, Kavitha Bharadwaj, Ting Gao, Quentin F. Polosky, Henry Paul S. Cervantes