Patents by Inventor Henry Samuel Marek

Henry Samuel Marek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6996209
    Abstract: Scintillator coatings having predetermined barrier protection, light transmission, and light reflection properties are described. These scintillators comprise: a scintillator material comprising a barrier coating disposed thereon, wherein the barrier coating: (1) provides barrier protection to the scintillator material, (2) is capable of transmitting light therethrough, and (3) is capable of reflecting light back into the scintillator material. The barrier coating may comprise a material that has been modified to have light transmissive and reflective properties in addition to protective properties, or it may comprise a protective material and a reflective material that have been co-deposited onto the scintillator material. The barrier coating is a single coating overlying the scintillator material in a substantially conformal manner.
    Type: Grant
    Filed: October 27, 2003
    Date of Patent: February 7, 2006
    Assignee: GE Medical Systems Global Technology Company, LLC
    Inventor: Henry Samuel Marek
  • Patent number: 6132675
    Abstract: Metal carbide supported polycrystalline diamond (PCD) compacts having improved abrasion/impact resistance properties and a method for making the same under high temperature/high pressure (HT/HP) processing conditions. The PCD compact is characterized as having a mixture of submicron sized diamond particles and large sized diamond particles.
    Type: Grant
    Filed: May 29, 1998
    Date of Patent: October 17, 2000
    Assignee: General Electric Company
    Inventors: Francis Raymond Corrigan, Henry Samuel Marek
  • Patent number: 6045440
    Abstract: The present invention relates to supported polycrystalline diamond compact cutters (PDC cutters) made under high temperature, high pressure (HT/HP) processing conditions, and more particularly to supported PDC cutters having non-planar cutting surfaces. More specifically, the present invention is for an oriented PDC cutter wherein chips and debris are funneled away from the cutting edge by a raised top surface of the polycrystalline diamond layer (PCD layer). The redirection of the debris is achieved by the creation of high and low regions on the PCD layer, of which there can be a variety of different surface geometry's. Thus, an object of the present invention is to provide a PDC cutter with improved performance through channeling debris away from its cutting edge.
    Type: Grant
    Filed: November 20, 1997
    Date of Patent: April 4, 2000
    Assignee: General Electric Company
    Inventors: David Mark Johnson, Gary Martin Flood, Henry Samuel Marek
  • Patent number: 5855996
    Abstract: Metal carbide supported polycrystalline diamond (PCD) compacts having improved abrasion/impact resistance properties and a method for making the same under high temperature/high pressure (HT/HP) processing conditions. The PCD compact is characterized as having a mixture of submicron sized diamond particles and large sized diamond particles.
    Type: Grant
    Filed: December 12, 1995
    Date of Patent: January 5, 1999
    Assignee: General Electric Company
    Inventors: Francis Raymond Corrigan, Henry Samuel Marek
  • Patent number: 5773140
    Abstract: Supported polycrystalline compacts having improved shear strength, impact, and fracture toughness properties, and methods for making the same under high temperature/high pressure (HT/HP) processing conditions. The method involves a HT/HP apparatus formed of a generally cylindrical reaction cell assembly having an inner chamber of predefined axial and radial extents and containing pressure transmitting medium, and a charge assembly having axial and radial surfaces and formed of at least one sub-assembly comprising a mass of crystalline particles adjacent a metal carbide support layer. The charge assembly is disposed within the chamber of the reaction cell assembly, with the pressure transmitting medium being interposed between the axial and radial surfaces of the charge assembly and the extents of the reaction cell chamber to define an axial pressure transmitting medium thickness, L.sub.h, and a radial pressure transmitting medium thickness, L.sub.r, the ratio of which, L.sub.h /L.sub.
    Type: Grant
    Filed: March 14, 1996
    Date of Patent: June 30, 1998
    Assignee: General Electric Company
    Inventors: David Bruce Cerutti, Henry Samuel Marek