Abstract: The present invention relates to a coffin with a lower side and an upper side. Said coffin comprises a structure and an inner lid, where the structure includes a first frame located on the lower side of the coffin, a second frame located on the upper side of the coffin, a plurality of ribs connected to the first frame, protruding towards the upper side, and connecting the second frame with said first frame, and a covering surface connected to the ribs. In turn, the inner lid has an arcuate shape and is arranged on an inner side of the second frame, where the ends of the inner lid arcuate shape lay on the ribs of the structure. Moreover, in some embodiments of the invention the coffin comprises at least one retractable handle arranged on the cover surface. Said handle can comprise a handgrip, a lanyard connected to the handgrip and to the first frame; and an elastic element connected to the cover surface and coupled to the lanyard.

Abstract: A method for authenticating a chain of custody utilizing blockchain technology, whereby digital evidence or other digital content is acquired and then hashed to produce a hash fingerprint/signature and then immediately or instantly submitting said hash fingerprint/signature to the blockchain using the blockchain network protocol, forming an immediate verifiable chain of custody without human interaction or requiring a trusted third party.

Abstract: Die stacking systems and methods are disclosed. In an embodiment, a semiconductor device includes a passivation surface and a conductive die receiving surface located in an opening of the passivation surface. The conductive die receiving surface has a surface area that is larger than a footprint of a second die that is electrically coupled to the conductive die receiving surface.

Abstract: Die stacking systems and methods are disclosed. In an embodiment, a semiconductor device includes a passivation surface and a conductive die receiving surface located in an opening of the passivation surface. The conductive die receiving surface has a surface area that is larger than a footprint of a second die that is electrically coupled to the conductive die receiving surface.

Abstract: Die stacking systems and methods are disclosed. In an embodiment, a die has a surface that includes a passivation area, at least one conductive bond pad area, and a conductive stacked die receiving area sized to receive at least a second die.