Patents by Inventor Henry Sanchez

Henry Sanchez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9159694
    Abstract: Die stacking systems and methods are disclosed. In an embodiment, a semiconductor device includes a passivation surface and a conductive die receiving surface located in an opening of the passivation surface. The conductive die receiving surface has a surface area that is larger than a footprint of a second die that is electrically coupled to the conductive die receiving surface.
    Type: Grant
    Filed: December 13, 2010
    Date of Patent: October 13, 2015
    Assignee: QUALCOMM Incorporated
    Inventors: Henry Sanchez, Laxminarayan Sharma
  • Publication number: 20110079905
    Abstract: Die stacking systems and methods are disclosed. In an embodiment, a semiconductor device includes a passivation surface and a conductive die receiving surface located in an opening of the passivation surface. The conductive die receiving surface has a surface area that is larger than a footprint of a second die that is electrically coupled to the conductive die receiving surface.
    Type: Application
    Filed: December 13, 2010
    Publication date: April 7, 2011
    Applicant: QUALCOMM Incorporated
    Inventors: Henry Sanchez, Laxminarayan Sharma
  • Publication number: 20080283993
    Abstract: Die stacking systems and methods are disclosed. In an embodiment, a die has a surface that includes a passivation area, at least one conductive bond pad area, and a conductive stacked die receiving area sized to receive at least a second die.
    Type: Application
    Filed: December 26, 2007
    Publication date: November 20, 2008
    Applicant: QUALCOMM INCORPORATED
    Inventors: Henry Sanchez, Laxminarayan Sharma