Abstract: In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.

Abstract: In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.

Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately.

Abstract: In some embodiments, a solid state lighting circuit may include one or more of the following features: (a) a plurality of emitters operably connected to a power supply (b) the power supply operably coupled in series with a current limiting device, where one or more of the emitters is bypassed with a switched circuit, and (c) at least one MOSFET switch operably coupled to the voltage divider circuit.

Abstract: In some embodiments, a solid state lighting circuit may include one or more of the following features: (a) a plurality of emitters operably connected to a power supply (b) the power supply operably coupled in series with a current limiting device, where one or more of the emitters is bypassed with a switched circuit, and (c) at least one MOSFET switch operably coupled to the voltage divider circuit.

Abstract: In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.

Abstract: Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.

Abstract: In some embodiments, a solid state lighting circuit may include one or more of the following features: (a) a plurality of emitters operably connected to a power supply (b) the power supply operably coupled in series with a current limiting device, where one or more of the emitters is bypassed with a switched circuit, and (c) at least one MOSFET switch operably coupled to the voltage divider circuit.

Abstract: In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.

Abstract: In some embodiments, a circuit board interconnect may include one or more of the following features: (a) a first circuit board having a plated through hole within a metal pad on the circuit board, the through hole providing a passage for solder to connect the first circuit board to a second circuit board, (b) a second circuit board having a metal pad able to couple to the first circuit board in an overlapping fashion when solder is passed through the plated through hole, and (c) a non-conductive solder repelling material on a surface of one circuit board.

Abstract: In some embodiments, a solid state lighting circuit may include one or more of the following features: (a) a plurality of emitters operably connected to a power supply (b) the power supply operably coupled in series with a current limiting device, where one or more of the emitters is bypassed with a switched circuit, and (c) at least one MOSFET switch operably coupled to the voltage divider circuit.

Abstract: A valve 100 comprising a magnetic circuit comprising a first member 101 and a pivotably mounted armature 102 the armature being movable between a position in which the valve seal 104 engages the valve seat 105 of valve port 103 to block the valve port 103, and a position away from the first member 101. A coil 106 surrounds the armature 102 which, when supplied with an electric current, creates a magnetic field in the armature 102 attracting the free end to the first member 101. Dampening pads 110 are provided on the armature 102. Each dampener pad 110 comprises a layer of viscoelastic material covered by a protective layer of polyetheretherketone (PEEK). During use, as there is wear between the armature 102 and the first member 101, and/or non magnetic section 107, the dampening pad 110 is compressed on impact by an increasing degree, thus the more worn the valve becomes, the more the dampening and thus the greater the protection against further wear.

Abstract: The present invention relates to a digital tram gauge assembly having an extendible elongate tram bar having a first height rod at a first end and a second height rod at a second end. A digital measuring device is positionable about the tram bar and is capable of digitally sensing, displaying and wirelessly transmitting measurement data from the digital tram gauge. The digital measuring device further includes a digital level sensor that functions as a digital level comparator to indicate whether the tram gauge assembly is oriented substantially parallel to a user-defined reference datum plane.

Abstract: In the context of a machine-vision system for inspecting a part, a method and apparatus to provide high-speed high accuracy 3D (three-dimensional) inspection of manufactured parts by reducing vibration. One system includes a machine-base unit and a table-base portion supported by the base unit. At least two upright portions are connected to the table-base portion. A first scanner support is coupled to the upright portions. An imager head is coupled to the scanner support, wherein the scanner support moves the imager head in a linear motion to scan the object. A connecting member including at least one vibration-absorbing portion connects to the upright portions to absorb vibrations of the upright portions.

Abstract: An improved card feeding apparatus and associated method for feeding plastic cards to a printer. The apparatus can be used in any system where plastic cards are fed into a printer, but has particular use in a self-service, automated card issuance kiosk. The apparatus includes a support structure, and a card cassette is mounted on the support structure for holding a plurality of cards. The card cassette is moveable relative to the support structure, with the card cassette defining a discrete position for each card. A card picker is mounted on the support structure, with the card picker being capable of picking any one of the plurality of cards from the card cassette. Since each card has a discrete position within the card cassette, the card cassette can be moved past the card picker and any one of the cards within the card cassette can be picked by the card picker, and subsequently fed to a printer to personalize the card.

Abstract: A system and method for accurate measurement of distance and location of an object. The system comprises low-cost optical signal generators, aligned in a known configuration, to project a two-dimensional geometric figure on the object to be measured, or on a target attached to the object. The system captures an image of the projected figure, determines the exact geometry (e.g., area or circumference) of the figure, and calculates the exact distance to the object based on comparison of that geometry to the known configuration of the laser line generators. The invention simultaneously determines relative X and Y position of the object, thereby giving accurate X, Y, and Z coordinates.

Abstract: A system and method for accurate measurement of distance and location of an object. The system comprises low-cost optical signal generators, aligned in a known configuration, to project a two-dimensional geometric figure on the object to be measured, or on a target attached to the object. The system captures an image of the projected figure, determines the exact geometry (e.g., area or circumference) of the figure, and calculates the exact distance to the object based on comparison of that geometry to the known configuration of the laser line generators. The invention simultaneously determines relative X and Y position of the object, thereby giving accurate X, Y, and Z coordinates.

Abstract: An imaging system employs a photoconductive material capable of bearing a latent photostatic image, a plurality of elongated parallel stripes adjacent the photoconductive material, selective scanning of the stripes to produce charge carriers within the photoconductive material, and time-ordered detection of the current created by the charge carriers with the plurality of elongated parallel stripes. Appropriate addressing of the stripes as they are scanned produces a pixellated representation of the latent image. The system has improved output signal strength and higher resolution than known systems.