Abstract: An additive process, for manufacturing multiple- (single or double) sided printed circuit boards, which advantageously provides substantial adhesion, very fine resolution and significant manufacturing time and cost savings over prior art processes, is disclosed. Specifically, a seed layer, comprised of conductive particles, such as carbon, dispersed throughout a binder capable of adhering to an unclad insulating printed circuit board substrate, is first applied over pre-defined locations on each surface of the substrate above which corresponding portions of a conductive pattern are to appear. This seed layer is also applied to coat substantially all the surface area of the walls of one or more holes formed through the substrate which are, in turn, to become plated-through holes. Thereafter, a conductive layer, such as copper, is electrolytically plated onto the seed layer in order to produce the conductive pattern and the plated-through holes.