Patents by Inventor Henry Xu

Henry Xu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEM AND METHOD FOR IDENTITY VERIFICATION
    Publication number: 20230342781
    Abstract: In variants, a method for identify verification can include: receiving a request, determining a specification, determining a set of trait instances for a user, and verifying the user according to the specification. However, the method can additionally or alternatively include any other suitable elements.
    Type: Application
    Filed: April 11, 2023
    Publication date: October 26, 2023
    Inventors: Matthew Deutsch, Ethan Shen, Vamsi Varanasi, Cole Winstanley, Henry Xu
  • Apparatus, system, and method for wireless connection in integrated circuit packages
    Patent number: 9837340
    Abstract: Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: December 5, 2017
    Assignee: Intel Corporation
    Inventors: Jiamiao Tang, Henry Xu, Shinichi Sakamoto
  • APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED CIRCUIT PACKAGES
    Publication number: 20160379920
    Abstract: Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die, The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
    Type: Application
    Filed: June 28, 2016
    Publication date: December 29, 2016
    Inventors: Jiamiao Tang, Henry Xu, Shinichi Sakamoto
  • Apparatus, system, and method for wireless connection in integrated circuit packages
    Patent number: 9385094
    Abstract: Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 16, 2015
    Date of Patent: July 5, 2016
    Assignee: Intel Corporation
    Inventors: Jiamiao Tang, Henry Xu, Shinichi Sakamoto
  • APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED CIRCUIT PACKAGES
    Publication number: 20150187713
    Abstract: Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
    Type: Application
    Filed: March 16, 2015
    Publication date: July 2, 2015
    Inventors: Jiamiao Tang, Henry Xu, Shinichi Sakamoto
  • Apparatus, system, and method for wireless connection in integrated circuit packages
    Patent number: 8981573
    Abstract: Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
    Type: Grant
    Filed: August 19, 2013
    Date of Patent: March 17, 2015
    Assignee: Intel Corporation
    Inventors: Jiamiao Tang, Henry Xu, Shinichi Sakamoto
  • Apparatus, system, and method for wireless connection in integrated circuit packages
    Patent number: 8963333
    Abstract: Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
    Type: Grant
    Filed: August 19, 2013
    Date of Patent: February 24, 2015
    Assignee: Intel Corporation
    Inventors: Jiamiao Tang, Henry Xu, Shinichi Sakamoto
  • APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED CIRCUIT PACKAGES
    Publication number: 20140042639
    Abstract: Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
    Type: Application
    Filed: August 19, 2013
    Publication date: February 13, 2014
    Inventors: Jiamiao Tang, Henry Xu, Shinichi Sakamoto
  • APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED CIRCUIT PACKAGES
    Publication number: 20130334707
    Abstract: Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
    Type: Application
    Filed: August 19, 2013
    Publication date: December 19, 2013
    Inventors: Jiamiao Tang, Henry Xu, Shinichi Sakamoto
  • Apparatus, system, and method for wireless connection in integrated circuit packages
    Patent number: 8513108
    Abstract: Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: August 20, 2013
    Assignee: Intel Corporation
    Inventors: Jiamiao Tang, Henry Xu, Shinichi Sakamoto
  • APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED CIRCUIT PACKAGES
    Publication number: 20120108053
    Abstract: Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
    Type: Application
    Filed: December 22, 2011
    Publication date: May 3, 2012
    Inventors: Jiamiao Tang, Henry Xu, Shinichi Sakamoto
  • Apparatus, system, and method for wireless connection in integrated circuit packages
    Patent number: 8084867
    Abstract: Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
    Type: Grant
    Filed: June 29, 2006
    Date of Patent: December 27, 2011
    Assignee: Intel Corporation
    Inventors: Jiamiao Tang, Henry Xu, Shinichi Sakamoto
  • Copper plating connection for multi-die stack in substrate package
    Patent number: 7981726
    Abstract: An embodiment of the present invention is a technique to construct a multi-die package. A stack of dice is formed from a base substrate in a package. The dice are positioned one on top of another and have copper plated segments for die interconnection. The dice are interconnected using copper plating to connect the copper plated segments.
    Type: Grant
    Filed: December 12, 2005
    Date of Patent: July 19, 2011
    Assignee: Intel Corporation
    Inventors: John J. Tang, Henry Xu, Jianmin Li, Xiang Yin Zeng
  • APPARATUS, SYSTEM, AND METHOD FOR WIRELESS CONNECTION IN INTEGRATED CIRCUIT PACKAGES
    Publication number: 20100244268
    Abstract: Some embodiments of the invention include a connecting structure between a support and at least one die attached to the support. The die includes a number of die bond pads on a surface of the die. The connecting structure includes a plurality of via and groove combinations. Conductive material is formed in the via and groove combinations to provide connection between the die bond pads and bond pads on the support. Other embodiments are described and claimed.
    Type: Application
    Filed: June 29, 2006
    Publication date: September 30, 2010
    Inventors: Jiamiao Tang, Henry Xu, Shinichi Sakamoto
  • Copper plating connection for multi-die stack in substrate package
    Publication number: 20070132082
    Abstract: An embodiment of the present invention is a technique to construct a multi-die package. A stack of dice is formed from a base substrate in a package. The dice are positioned one on top of another and have copper plated segments for die interconnection. The dice are interconnected using copper plating to connect the copper plated segments.
    Type: Application
    Filed: December 12, 2005
    Publication date: June 14, 2007
    Inventors: John Tang, Henry Xu, Jianmin Li, Xiang Zeng
  • Debossed chewing gum stick
    Patent number: D822332
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: July 10, 2018
    Assignee: WM. WRIGLEY JR. COMPANY
    Inventors: Paul J. Angeloni, Lok Yan Chan, Marnie Chang, Phoebe Evans, Lavinel Popa, Henry Xu