Patents by Inventor Heo-jung Hwang

Heo-jung Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-chip package with spacer for blocking interchip heat transfer
    Patent number: 8698304
    Abstract: A multi-chip package comprises a semiconductor chip stack structure comprising a semiconductor chip stack including a first semiconductor chip having a first power rating and a second semiconductor chip having a second power rating, the first and second semiconductor chips being stacked one on top of another; and a heat transfer blocking spacer interposed between the first semiconductor chip and the second semiconductor chip.
    Type: Grant
    Filed: May 11, 2007
    Date of Patent: April 15, 2014
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jae-wook Yoo, Eun-seok Cho, Heo-jung Hwang
  • MULTI-CHIP PACKAGE WITH SPACER FOR BLOCKING INTERCHIP HEAT TRANSFER
    Publication number: 20080054433
    Abstract: A multi-chip package comprises a semiconductor chip stack structure comprising a semiconductor chip stack including a first semiconductor chip having a first power rating and a second semiconductor chip having a second power rating, the first and second semiconductor chips being stacked one on top of another; and a heat transfer blocking spacer interposed between the first semiconductor chip and the second semiconductor chip.
    Type: Application
    Filed: May 11, 2007
    Publication date: March 6, 2008
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Jae-wook Yoo, Eun-seok Cho, Heo-jung Hwang