Patents by Inventor Heok-Jae Lee
Heok-Jae Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10538843Abstract: A vaporizer includes a main body including a first body and a second body. The first body has an upper portion narrowing in a direction of a height of the first body and the second body has a cavity in which the first body is positioned. A mixing chamber is between the first and second bodies. The second body includes a carrier gas injection path connected to a carrier gas inlet formed in an upper portion of the mixing chamber. The carrier gas injection path carries a carrier gas. A source material injection path is connected to a source material inlet formed in the mixing chamber. The source material injection path carries a liquid source material. A discharge is connected to an outlet formed in a lower portion of the mixing chamber. A mixed fluid including the carrier gas and the liquid source material is discharged through the discharge path.Type: GrantFiled: December 20, 2016Date of Patent: January 21, 2020Assignees: SAMSUNG ELECTRONICS CO., LTD., HORIBA STEC, CO., LTD.Inventors: Hyun-Sik Sim, Jung-Suk Oh, Jae-Seok Kim, Ho-Gon Kim, Jun-Won Lee, Hyuk-Yul Choi, Hyung-Ho Kim, Sang-Jin Choi, Heok-Jae Lee, Dong-Ok Shin, Jang-Hyoun Youm, Ichiro Nishikawa, Masanori Terasaka, Masashi Hamada, Tae-Hoon Lee
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Patent number: 10522379Abstract: A substrate transfer apparatus includes: a chamber including a lower surface, an upper surface opposing the lower surface, and a side surface extending between the lower surface and the upper surface; and a fan filter unit disposed on the upper surface of the chamber and configured to introduce air into the chamber. The chamber includes an inclined surface extending from the upper surface to the side surface and positioned to a side of the fan filter unit.Type: GrantFiled: September 18, 2017Date of Patent: December 31, 2019Assignee: Samsung Electronics Co., Ltd.Inventors: Dae Wee Kong, Kang Min Park, Chul Hwan Choi, Yong Joon Hong, Kang Soo Kim, Sang Ho Roh, Heok Jae Lee, Sang Jin Choi
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Publication number: 20180122676Abstract: A substrate transfer apparatus includes: a chamber including a lower surface, an upper surface opposing the lower surface, and a side surface extending between the lower surface and the upper surface; and a fan filter unit disposed on the upper surface of the chamber and configured to introduce air into the chamber. The chamber includes an inclined surface extending from the upper surface to the side surface and positioned to a side of the fan filter unit.Type: ApplicationFiled: September 18, 2017Publication date: May 3, 2018Inventors: Dae Wee Kong, Kang Min Park, Chul Hwan Choi, Yong Joon Hong, Kang Soo Kim, Sang-Ho Roh, Heok Jae Lee, Sang Jin Choi
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Patent number: 9773645Abstract: A remote plasma generator includes a body, a driver, and a protection tube. The body includes a gas injection port, a plasma exhaust port, and a plasma generation pipe through which discharge gas or plasma flow. The driver is coupled to the body and generates a magnetic field and plasma in the body. The protection tube is at an inner side of the plasma generation pipe to protect the plasma generation pipe from plasma.Type: GrantFiled: January 29, 2016Date of Patent: September 26, 2017Assignees: SAMSUNG ELECTRONICS CO., LTD., DANDAN CO., LTD., NEW POWER PLASMA CO., LTD.Inventors: Ja-woo Lee, Chung-huan Jeon, Heok-jae Lee, Jang-hyoun Youm, Sang-jean Jeon, Kwang-young Jung, Sun-uk Kim, Kang-ho Lee, Jung-hyun Cho, Soon-im Wi, Yun-sik Yang, Moo-jin Kim, Jang-kyu Choi
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Publication number: 20170241015Abstract: A vaporizer includes a main body including a first body and a second body. The first body has an upper portion narrowing in a direction of a height of the first body and the second body has a cavity in which the first body is positioned. A mixing chamber is between the first and second bodies. The second body includes a carrier gas injection path connected to a carrier gas inlet formed in an upper portion of the mixing chamber. The carrier gas injection path carries a carrier gas. A source material injection path is connected to a source material inlet formed in the mixing chamber. The source material injection path carries a liquid source material. A discharge is connected to an outlet formed in a lower portion of the mixing chamber. A mixed fluid including the carrier gas and the liquid source material is discharged through the discharge path.Type: ApplicationFiled: December 20, 2016Publication date: August 24, 2017Applicant: HORIBA STEC, CO., LTD.Inventors: HYUN-SIK SIM, JUNG-SUK OH, JAE-SEOK KIM, HO-GON KIM, JUN-WON LEE, HYUK-YUL CHOI, HYUNG-HO KIM, SANG-JIN CHOI, HEOK-JAE LEE, DONG-OK SHIN, JANG-HYOUN YOUM, ICHIRO NISHIKAWA, MASANORI TERASAKA, MASASHI HAMADA, TAE-HOON LEE
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Publication number: 20160307739Abstract: A remote plasma generator includes a body, a driver, and a protection tube. The body includes a gas injection port, a plasma exhaust port, and a plasma generation pipe through which discharge gas or plasma flow. The driver is coupled to the body and generates a magnetic field and plasma in the body. The protection tube is at an inner side of the plasma generation pipe to protect the plasma generation pipe from plasma.Type: ApplicationFiled: January 29, 2016Publication date: October 20, 2016Applicants: DANDAN CO., LTD., New Power Plasma Co., Ltd.Inventors: Ja-woo LEE, Chung-huan JEON, Heok-jae LEE, Jang-hyoun YOUM, Sang-jean JEON, Kwang-young JUNG, Sun-uk KIM, Kang-ho LEE, Jung-hyun CHO, Soon-im WI, Yun-sik YANG, Moo-jin KIM, Jang-kyu CHOI
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Patent number: 8600150Abstract: A wafer aligning apparatus includes a laser sensor that generates a trigger signal, a CCD camera imaging a wafer in response to the trigger signal, a signal processing unit that calculates a center alignment correction value for the wafer, and a robot controller that receives the center alignment correction value to control movement of a transfer robot. The laser sensor generates the trigger signal in accordance with a change in reflected light detected by the laser sensor, the change in the amount of reflected light being detected by the laser sensor when a boundary between a blade of the transfer robot and a coupler of the transfer robot passes under the laser sensor.Type: GrantFiled: October 8, 2010Date of Patent: December 3, 2013Assignee: Samsung Electronics Co., Ltd.Inventors: Heok-Jae Lee, Sang-Ho Kim, Hyu-Rim Park, Do-In Bae, Kee-Weone Seo, Chang-Woo Woo
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Publication number: 20110050882Abstract: A wafer aligning apparatus includes a laser sensor that generates a trigger signal, a CCD camera imaging a wafer in response to the trigger signal, a signal processing unit that calculates a center alignment correction value for the wafer, and a robot controller that receives the center alignment correction value to control movement of a transfer robot. The laser sensor generates the trigger signal in accordance with a change in reflected light detected by the laser sensor, the change in the amount of reflected light being detected by the laser sensor when a boundary between a blade of the transfer robot and a coupler of the transfer robot passes under the laser sensor.Type: ApplicationFiled: October 8, 2010Publication date: March 3, 2011Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Heok-Jae LEE, Sang-Ho KIM, Hyu-Rim PARK, Do-In BAE, Kee-Weone SEO, Chang-Woo WOO
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Patent number: 7813542Abstract: Embodiments of the invention provide a wafer aligning apparatus and a wafer aligning method. In one embodiment, the wafer aligning apparatus comprises an imaging unit adapted to take an image of a wafer being transferred from a load lock chamber to a transfer chamber and adapted to convert the image into digital signals, and a signal processing unit adapted to calculate a center alignment correction value for the wafer by comparing the digital signals to a master image stored in the signal processing unit. The wafer aligning apparatus further comprises a robot controller adapted to receive the center alignment correction value from the signal processing unit and adapted to control a transfer robot in accordance with the center alignment correction value to provide the wafer to a process chamber such that the center of the wafer is substantially aligned.Type: GrantFiled: December 20, 2006Date of Patent: October 12, 2010Assignee: Samsung Electronics Co., Ltd.Inventors: Heok-Jae Lee, Sang-Ho Kim, Hyu-Rim Park, Do-In Bae, Kee-Weone Seo, Chang-Woo Woo
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Publication number: 20080095953Abstract: Provided are an apparatus for depositing a thin film using plasma which can prevent impurities from being formed by inhibiting plasma from being diffused into a nozzle pipe and sustained in the nozzle pipe and improve thickness uniformity of the deposited thin film and a method of depositing the same. The apparatus for depositing a thin film includes a chamber having a substrate holder and an inner space defined by an inner wall; and a nozzle pipe comprising a first end fixed to the inner wall of the chamber; a second end extending into the inner space of the chamber; a flow path penetrating the nozzle pipe from the first end to the second end; and at least one slit which is disposed at the second end and opens the flow path into the inner space of the chamber.Type: ApplicationFiled: October 24, 2007Publication date: April 24, 2008Applicant: SAMSUNG ELECTRONICS CO., LTD.Inventors: Heok-Jae LEE, Jung-Hun CHO, Se-Hwi CHO, Yun-Sik YANG, Yong-Gyu LIM
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Publication number: 20070189596Abstract: Embodiments of the invention provide a wafer aligning apparatus and a wafer aligning method. In one embodiment, the wafer aligning apparatus comprises an imaging unit adapted to take an image of a wafer being transferred from a load lock chamber to a transfer chamber and adapted to convert the image into digital signals, and a signal processing unit adapted to calculate a center alignment correction value for the wafer by comparing the digital signals to a master image stored in the signal processing unit. The wafer aligning apparatus further comprises a robot controller adapted to receive the center alignment correction value from the signal processing unit and adapted to control a transfer robot in accordance with the center alignment correction value to provide the wafer to a process chamber such that the center of the wafer is substantially aligned.Type: ApplicationFiled: December 20, 2006Publication date: August 16, 2007Inventors: Heok-Jae Lee, Sang-Ho Kim, Hyu-Rim Park, Do-In Bae, Kee-Weone Seo, Chang-Woo Woo
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Publication number: 20070004058Abstract: Semiconductor manufacturing equipment is disclosed and comprises a robot comprising a robotic arm adapted to transfer a wafer from a wafer cassette in a load lock chamber to a processing chamber with proper alignment and positioning without the need to intermediately pass through a support chamber specially adapted to align and position the wafer.Type: ApplicationFiled: July 3, 2006Publication date: January 4, 2007Inventors: Heok-Jae Lee, Sung-Wook Park, Do-In Bae, Kee-Weone Seo, Chang-Woo Woo, Tae-Won Lee