Abstract: The present invention relates to an air conditioner for a vehicle, which can improve a gear ratio of a power transmission means in order to operate a sliding door with more torque. The air conditioner for a vehicle includes: an air-conditioning case having a heat exchanger; a first door and a second door disposed inside the air-conditioning case to adjust the degree of opening of an air passageway; a first driving part for operating the first door; a power transmission part connected to the first driving part; a second driving part for operating the second door; and a third driving part for connecting the power transmission part with the second driving part.

Abstract: The present invention relates to an air conditioner for a vehicle, which includes an air-conditioning case (200), and at least one door (100) mounted to be opened and closed at a predetermined position, wherein the door (100) is formed integrally with an arm pivot (140), and the arm pivot (140) includes a pin part, and ribs formed integrally with both sides of the pin part to reinforce rigidity of the pin part and offset noise. The air conditioner further includes distortion preventing parts formed on a rotary shaft to be dented and to be crossed to each other, thereby reducing a transformation rate of the door and securing accuracy of the pin part.

Abstract: The present invention relates to an air conditioner for a vehicle, which includes an air-conditioning case (200), and at least one door (100) mounted to be opened and closed at a predetermined position, wherein the door (100) is formed integrally with an arm pivot (140), and the arm pivot (140) includes a pin part, and ribs formed integrally with both sides of the pin part to reinforce rigidity of the pin part and offset noise. The air conditioner further includes distortion preventing parts formed on a rotary shaft to be dented and to be crossed to each other, thereby reducing a transformation rate of the door and securing accuracy of the pin part.

Abstract: The present invention relates to an air conditioner for a vehicle, which includes an air-conditioning case (200), and at least one door (100) mounted to be opened and closed at a predetermined position, wherein the door (100) is formed integrally with an arm pivot (140), and the arm pivot (140) includes a pin part, and ribs formed integrally with both sides of the pin part to reinforce rigidity of the pin part and offset noise. The air conditioner further includes distortion preventing parts formed on a rotary shaft to be dented and to be crossed to each other, thereby reducing a transformation rate of the door and securing accuracy of the pin part.

Abstract: Disclosed is an air conditioner for a vehicle, which makes it possible for an upper case and a lower case to be assembled in correct position without minute misassembly between the upper case and the lower case, thereby making operation of a sliding door smooth. The air conditioner, which includes an air-conditioning case having a plurality of cases and a door disposed inside the air-conditioning case to be able to slide, further includes: a shape-matching part where the plurality of cases are matched each other in shape; and a guide part crossing the shape-matching part to guide a sliding action of the door, wherein a cross section of the guide part at the shape-matching part is formed to be eccentric.

Abstract: An electromagnetic coupling device and a wireless communication system comprising same are disclosed. One embodiment comprises: an antenna part having an impedance component; and an attachment part which attaches an electromagnetic coupling device to a conductor such that a certain interval is formed between the antenna part and the conductor, and which forms a capacitance between the antenna part and the conductor.

Abstract: The present invention relates to a blower unit of an air conditioner for a vehicle, which can enhance air-conditioning performance through uniform upper and lower pressure control since compensating and supplementing different air resistances between an upper scroll case and a lower scroll case. The blower unit of the two-layered air conditioner for a vehicle, which separates and blows indoor air and outdoor air, includes: a first scroll in which a first blower wheel is disposed and a first air passageway is formed; and a second scroll arranged below the first scroll, and having a second blower wheel and a second air passageway, wherein a diameter of the second blower wheel and a diameter of the first blower wheel are different from each other.

Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, an encapsulant sealing at least a portion of the inactive surface, a first connection member disposed on the active surface and including a redistribution layer and a first via electrically connecting the connection pad to the redistribution layer, a passivation layer disposed on the first connection member, and an under-bump metal layer including an external connection pad disposed on the passivation layer and a second via connecting the external connection pad to the redistribution layer. In a vertical direction, the first and second vias are disposed within the external connection pad and do not overlap each other.

Abstract: A chip electronic component includes a magnetic body including magnetic metal powder particles, an internal coil unit embedded in the magnetic body, and a cover unit disposed on at least one of upper and lower surfaces of the magnetic body and including a magnetic metal plate. The magnetic metal plate is cracked and includes a plurality of metal fragments.

Abstract: A semiconductor package includes a wiring portion including an insulating layer, conductive patterns disposed on the insulating layer, and conductive vias penetrating through the insulating layer and connected to the conductive patterns, a semiconductor chip disposed on the wiring portion, an encapsulant disposed on the wiring portion and encapsulating at least a portion of the semiconductor chip, and a metal layer disposed on the semiconductor chip and the encapsulant and having a thickness of 10 ?m to 70 ?m.

Abstract: The present invention relates to an air conditioner for a vehicle, which can improve a gear ratio of a power transmission means in order to operate a sliding door with more torque. The air conditioner for a vehicle includes: an air-conditioning case having a heat exchanger; a first door and a second door disposed inside the air-conditioning case to adjust the degree of opening of an air passageway; a first driving part for operating the first door; a power transmission part connected to the first driving part; a second driving part for operating the second door; and a third driving part for connecting the power transmission part with the second driving part.

Abstract: Disclosed is an air conditioner for a vehicle, which makes it possible for an upper case and a lower case to be assembled in correct position without minute misassembly between the upper case and the lower case, thereby making operation of a sliding door smooth. The air conditioner, which includes an air-conditioning case having a plurality of cases and a door disposed inside the air-conditioning case to be able to slide, further includes: a shape-matching part where the plurality of cases are matched each other in shape; and a guide part crossing the shape-matching part to guide a sliding action of the door, wherein a cross section of the guide part at the shape-matching part is formed to be eccentric.

Abstract: A multilayer ceramic electronic component includes: a body part including dielectric layers and internal electrodes disposed to face each other with respective dielectric layers interposed therebetween; and external electrodes disposed on an outer surface of the body part and electrically connected to the internal electrodes. The dielectric layer includes grains including: a semiconductive or conductive grain core region containing a base material represented by ABO3, where A is at least one of Ba, Sr, and Ca, and B is at least one of Ti, Zr, and Hf, and a doping material including a rare earth element; and an insulating grain shell region enclosing the grain core region.

Abstract: A method of manufacturing a coil device and the coil device includes a base layer and a coil pattern formed on a surface of the base layer. The method of manufacturing a coil device includes forming a seed layer of a coil by bonding a copper foil to a base layer, etching to remove a portion of the copper foil, and plating a plating layer on the seed layer.

Abstract: A fan-out semiconductor package includes a semiconductor chip having an active surface on which a connection pad is disposed and an inactive surface opposing the active surface, an encapsulant sealing at least a portion of the inactive surface, a first connection member disposed on the active surface and including a redistribution layer and a first via electrically connecting the connection pad to the redistribution layer, a passivation layer disposed on the first connection member, and an under-bump metal layer including an external connection pad disposed on the passivation layer and a second via connecting the external connection pad to the redistribution layer. In a vertical direction, the first and second vias are disposed within the external connection pad and do not overlap each other.

Abstract: The fan-out semiconductor package includes: a semiconductor chip having an active surface having a connection pad disposed thereon and an inactive surface disposed to oppose the active surface; a first capacitor disposed adjacently to the semiconductor chip; an encapsulant at least partially encapsulating the first connection member and the semiconductor chip; a first connection member disposed on the encapsulant, the first capacitor, and the semiconductor chip, and a second capacitor disposed on the other surface of the first connection member opposing one surface of the first connection member on which the semiconductor chip is disposed, wherein the first connection member includes a redistribution layer electrically connected to the connection pad of the semiconductor chip, the first capacitor, and the second capacitor, and the first capacitor and the second capacitor are electrically connected to the connection pad through a common power wiring of the redistribution layer.

Abstract: The present invention relates to an air conditioner for a vehicle, which includes an air-conditioning case (200), and at least one door (100) mounted to be opened and closed at a predetermined position, wherein the door (100) is formed integrally with an arm pivot (140), and the arm pivot (140) includes a pin part, and ribs formed integrally with both sides of the pin part to reinforce rigidity of the pin part and offset noise. The air conditioner further includes distortion preventing parts formed on a rotary shaft to be dented and to be crossed to each other, thereby reducing a transformation rate of the door and securing accuracy of the pin part.

Abstract: The present disclosure relates to a fan-out semiconductor package and a method of manufacturing the same. The fan-out semiconductor package includes: a first connection member having a through-hole; a semiconductor chip disposed in the through-hole; an encapsulant encapsulating at least portions of the first connection member and the semiconductor chip; and a second connection member disposed on the first connection member and the semiconductor chip. The first connection member includes a first insulating layer, a first redistribution layer and a second redistribution layer disposed on one surface and the other surface of the first insulating layer opposing the one surface thereof, respectively, a second insulating layer disposed on the first insulating layer and covering the first redistribution layer, and a third redistribution layer disposed on the second insulating layer. A fan-out semiconductor package may include one or more connection units instead of the first connection member.

Abstract: An electronic component package and a method of manufacturing the same are provided. The electronic component package includes a frame having a through-hole, an electronic component disposed in the through-hole of the frame, and a redistribution part disposed at one side of the frame and the electronic component. One or more first wiring layers of the frame are electrically connected to the electronic component through the redistribution part.

Abstract: A semiconductor package includes a wiring portion including an insulating layer, conductive patterns disposed on the insulating layer, and conductive vias penetrating through the insulating layer and connected to the conductive patterns, a semiconductor chip disposed on the wiring portion, an encapsulant disposed on the wiring portion and encapsulating at least a portion of the semiconductor chip, and a metal layer disposed on the semiconductor chip and the encapsulant and having a thickness of 10 ?m to 70 ?m.