Abstract: The present disclosure relates to a purple dye compound for a color filter and a coloring resin composition for a color filter containing the same. The novel xanthene-based purple dye compound or the polymer dye compound obtained using the same as a monomer has superior solvent resistance and superior miscibility with a pigment in an organic solvent. Further, it exhibits superior heat resistance, chemical resistance, light resistance and brightness due to the homopolymer structure. Accordingly, a coloring resin composition containing the same can be used widely as a dye for synthetic resins and synthetic fibers, as a coloring agent for polymer materials, for a color filter used in LCDs, PDPs, etc., and so forth.

Abstract: The present disclosure relates to a blue dye compound for a color filter and a coloring resin composition for a color filter containing the same. Since the blue resin composition according to the present disclosure, which contains the novel triarylmethane blue dye compound or the polymer dye compound obtained using the same as a monomer, has superior solubility in an organic solvent such as propylene glycol monomethyl ether acetate (PGMEA), cyclohexanone, etc. as well as superior miscibility with another pigment and high brightness, it can be used to prepare a color filter exhibiting superior heat resistance, light resistance and brightness.

Abstract: A wafer inspection method comprises: performing an exposure process on a wafer partitioned into fields, wherein the exposure process is performed on a first plurality of the fields in a first scan direction and wherein the exposure process is performed on a second plurality of the fields in a second scan direction; storing scan direction information for the first plurality of fields and the second plurality of fields corresponding to whether the exposure process is performed in the first scan direction or in the second scan direction; obtaining image information on the surface of the wafer subjected to the exposure process; determining whether a repetitive defect pattern is present in the image information; and determining whether the repetitive defect pattern is dependent on scan direction by identifying a correlation between the presence of repetitive defect patterns on the wafer and the scan direction information.