Patents by Inventor Heon Su JEONG

Heon Su JEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240111695
    Abstract: A memory device of a memory module includes a CA buffer that receives a command/address (CA) signal through a bus shared by a memory device different from the memory device of the memory module, and a calibration logic circuit that identifies location information of the memory device on the bus. The memory device recognizes its own location on a bus in a memory module to perform self-calibration, and thus, the memory device appropriately operates even under an operation condition varying depending on a location in the memory module.
    Type: Application
    Filed: December 13, 2023
    Publication date: April 4, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Heon Su JEONG, Hangi Jung, Wangsoo Kim, Hae Young Chung
  • Patent number: 11874784
    Abstract: A memory device of a memory module includes a CA buffer that receives a command/address (CA) signal through a bus shared by a memory device different from the memory device of the memory module, and a calibration logic circuit that identifies location information of the memory device on the bus. The memory device recognizes its own location on a bus in a memory module to perform self-calibration, and thus, the memory device appropriately operates even under an operation condition varying depending on a location in the memory module.
    Type: Grant
    Filed: December 27, 2022
    Date of Patent: January 16, 2024
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Heon Su Jeong, Hangi Jung, Wangsoo Kim, Hae Young Chung
  • Publication number: 20230131945
    Abstract: A memory device of a memory module includes a CA buffer that receives a command/address (CA) signal through a bus shared by a memory device different from the memory device of the memory module, and a calibration logic circuit that identifies location information of the memory device on the bus. The memory device recognizes its own location on a bus in a memory module to perform self-calibration, and thus, the memory device appropriately operates even under an operation condition varying depending on a location in the memory module.
    Type: Application
    Filed: December 27, 2022
    Publication date: April 27, 2023
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Heon Su JEONG, Hangi JUNG, Wangsoo KIM, Hae Young CHUNG
  • Patent number: 11567886
    Abstract: A memory device of a memory module includes a CA buffer that receives a command/address (CA) signal through a bus shared by a memory device different from the memory device of the memory module, and a calibration logic circuit that identifies location information of the memory device on the bus. The memory device recognizes its own location on a bus in a memory module to perform self-calibration, and thus, the memory device appropriately operates even under an operation condition varying depending on a location in the memory module.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: January 31, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Heon Su Jeong, Hangi Jung, Wangsoo Kim, Hae Young Chung
  • Publication number: 20210141747
    Abstract: A memory device of a memory module includes a CA buffer that receives a command/address (CA) signal through a bus shared by a memory device different from the memory device of the memory module, and a calibration logic circuit that identifies location information of the memory device on the bus. The memory device recognizes its own location on a bus in a memory module to perform self-calibration, and thus, the memory device appropriately operates even under an operation condition varying depending on a location in the memory module.
    Type: Application
    Filed: August 31, 2020
    Publication date: May 13, 2021
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Heon Su JEONG, Hangi JUNG, Wangsoo Kim, Hae Young CHUNG