Patents by Inventor Heoncheol OH

Heoncheol OH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Double-sided cooling type power module and manufacturing method therefor
    Patent number: 12080674
    Abstract: A power module includes: a first substrate having metal plates formed on one surface thereof; a second substrate spaced apart from the first substrate and having metal plates formed on one surface thereof facing the metal plates of the first substrate; a plurality of power elements disposed between the first substrate and the second substrate; a first electrode formed on the first substrate of each of the plurality of power elements; and a second electrode formed on the second surface of each of the plurality of power elements, where the plurality of power elements comprise a first power element in which the first electrode is bonded to the metal plates of the second substrate; and a second power element in which the first electrode is bonded to the metal plates of the first substrate.
    Type: Grant
    Filed: October 2, 2023
    Date of Patent: September 3, 2024
    Assignee: LG Electronics Inc.
    Inventors: Heoncheol Oh, Jaesang Min, Yonghee Park, Jinwoo Lee, Heejin Cho
  • DOUBLE-SIDED COOLING TYPE POWER MODULE AND MANUFACTURING METHOD THEREFOR
    Publication number: 20240030177
    Abstract: A power module includes: a first substrate having metal plates formed on one surface thereof; a second substrate spaced apart from the first substrate and having metal plates formed on one surface thereof facing the metal plates of the first substrate; a plurality of power elements disposed between the first substrate and the second substrate; a first electrode formed on the first substrate of each of the plurality of power elements; and a second electrode formed on the second surface of each of the plurality of power elements, where the plurality of power elements comprise a first power element in which the first electrode is bonded to the metal plates of the second substrate; and a second power element in which the first electrode is bonded to the metal plates of the first substrate.
    Type: Application
    Filed: October 2, 2023
    Publication date: January 25, 2024
    Inventors: Heoncheol OH, Jaesang MIN, Yonghee PARK, Jinwoo LEE, Heejin CHO
  • Double-sided cooling type power module and manufacturing method therefor
    Patent number: 11810887
    Abstract: A power module includes a first substrate including a first metal plate, a second substrate spaced apart from the first substrate and having a second metal facing the first substrate, a plurality of power elements that are disposed between the first substrate and the second substrate and include a first electrode and a second electrode. The plurality of power elements include a first power element having the first electrode bonded to the second metal plate, and a second power element having the first electrode bonded to the first metal plate.
    Type: Grant
    Filed: October 19, 2018
    Date of Patent: November 7, 2023
    Assignee: LG Electronics Inc.
    Inventors: Heoncheol Oh, Jaesang Min, Yonghee Park, Jinwoo Lee, Heejin Cho
  • DOUBLE-SIDED COOLING TYPE POWER MODULE AND MANUFACTURING METHOD THEREFOR
    Publication number: 20210057372
    Abstract: A power module includes a first substrate including a first metal plate, a second substrate spaced apart from the first substrate and having a second metal facing the first substrate, a plurality of power elements that are disposed between the first substrate and the second substrate and include a first electrode and a second electrode. (New) The plurality of power elements include a first power element having the first electrode bonded to the second metal plate, and a second power element having the first electrode bonded to the first metal plate.
    Type: Application
    Filed: October 19, 2018
    Publication date: February 25, 2021
    Inventors: Heoncheol OH, Jaesang MIN, Yonghee PARK, Jinwoo LEE, Heejin CHO