Abstract: A system and method for programmable in-situ launch and capture clock generation is provided. The system provides an efficient and improved manner for delay and signal transition fault testing in electronic circuits. The system comprises i) an in-situ delay clock generator for generating one or more clocks; ii) a pulse Programmable Selection Generator (PSG) which can be either a pulse PSG and/or an expanded pulse PSG for generating the sequence in which the clocks are to be selected, the clocks being selected with a delay; and iii) a multiplexer for selecting the plurality of clocks, based on the generated sequence, the selected clocks being used for generating the launch and capture clocks.

Abstract: Embodiments relate to a dual metal interconnection structure of a semiconductor device and a method for manufacturing the same. In embodiments, the dual metal interconnection structure may include a contact plug selectively formed in an interlayer dielectric, which covers a silicon substrate, and contacted with an active area of the silicon substrate, a first aluminum interconnection formed on one contact plug in every two cells and having a width larger than a width of the contact plug, a dielectric wrapping an upper surface and a side plane of the first aluminum interconnection, and a second aluminum interconnection formed on one contact plug in every two cells alternatively with the first aluminum interconnection, insulated from the first aluminum interconnection by the dielectric, and having a width larger than a width of the contact plug.

Abstract: Disclosed is a non-volatile (e.g., NOR type flash) memory cell array and a method for manufacturing the same. The memory cell array includes a plurality of isolation layers on a semiconductor substrate, parallel to a bit line and defining an active device area, a plurality of common source areas in the semiconductor substrate, separated from each other by the isolation layers such that the common source areas connect memory cells adjacent to each other in a bit line direction, a common source line on the semiconductor substrate, connected to each source area and extending in a word-line direction, an insulating spacer along a first sidewall of the common source line, a gate at a second sidewall of the insulating spacer including a tunnel oxide layer, a first electrode, an inter-electrode dielectric layer, and a second electrode, and a drain area in the semiconductor substrate on an opposite side of the gate from the common source area.

Abstract: A nonvolatile memory device including a floating gate formed on a tunnel oxide layer that is formed on a semiconductor substrate. The device also includes a drain region formed in the substrate adjacent to one side of the floating gate, a source region formed in the substrate adjacent to another side of the floating gate, where the source region is apart from the floating gate, and an inter-gate insulating layer formed on a portion of an active region between the source region and the floating gate and on a sidewall of the floating gate directing toward the source region, as well as on a sidewall of the floating gate directing toward the drain region. The device includes a word line formed over the floating gate and being across the substrate in one direction, and a field oxide layer interposing between the word line and the source region and between the word line and the drain region, and intersecting the word line.

Abstract: A method for fabricating a nonvolatile memory device including successively forming a first oxide layer, an electrically conductive layer, a second oxide layer, a nitride layer and a third oxide layer on a semiconductor substrate. The method also includes patterning the third oxide layer, forming spacers at sidewalls of the third oxide layer, forming a trench in the substrate by selectively etching the substrate with the third oxide layer as a mask, filling the trench with fourth oxide layer, and removing the third oxide layer, the nitride layer and the second oxide layer. Before filling the trench with the fourth oxide layer, a liner oxide layer is formed on inner walls of the trench. The fourth oxide layer is high density plasma (HDP) oxide and tetrafluoroethane (Si(OC2H5)4). During the filling the trench, lower corners of the conductive layer are made have rounded structure or bird's beak structure.

Abstract: Disclosed is a method for forming a non-volatile memory device, comprising the steps of: successively depositing a gate oxide and a floating gate material on a semiconductor substrate; depositing and selectively etching a first dielectric on the floating gate material to form a first dielectric pattern; forming a first floating gate oxide on the floating gate material; selectively etching the floating gate material with using the first dielectric pattern as a mask to form a floating gate pattern; forming an insulating layer on the floating gate pattern; etching a portion of the semiconductor substrate between neighboring floating gate patterns to form a trench in the substrate; depositing a control gate oxide on surfaces of the trench; depositing a control gate material to fill the trench and to cover the substrate surface; depositing a second dielectric on the control gate material; selectively etching the second dielectric and the control gate material to form a control gate pattern and a second dielectric