Patents by Inventor Heonjun LIM

Heonjun LIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 10665557
    Abstract: A semiconductor device includes a semiconductor substrate having a chip region and an edge region, a lower dielectric layer on the semiconductor substrate, a chip pad on the lower dielectric layer of the chip region, an upper dielectric layer on the lower dielectric layer, which includes a first opening exposing the chip pad on the chip region and a second opening exposing the lower dielectric layer on the edge region, and a redistribution pad connected to the chip pad. The redistribution pad includes a via portion in the first opening and a pad portion extending from the via portion onto the upper dielectric layer.
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: May 26, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jung-Hoon Han, Sungjin Kim, Junyong Noh, Heonjun Lim
  • SEMICONDUCTOR DEVICE
    Publication number: 20190035750
    Abstract: A semiconductor device includes a semiconductor substrate having a chip region and an edge region, a lower dielectric layer on the semiconductor substrate, a chip pad on the lower dielectric layer of the chip region, an upper dielectric layer on the lower dielectric layer, which includes a first opening exposing the chip pad on the chip region and a second opening exposing the lower dielectric layer on the edge region, and a redistribution pad connected to the chip pad. The redistribution pad includes a via portion in the first opening and a pad portion extending from the via portion onto the upper dielectric layer.
    Type: Application
    Filed: June 4, 2018
    Publication date: January 31, 2019
    Inventors: Jung-Hoon Han, Sungjin KIM, Junyong NOH, Heonjun LIM