Patents by Inventor Heping YU

Heping YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11661467
    Abstract: The present disclosure discloses a high-performance rubber damping material and a method for preparing the same, relating to the technical field of damping materials. The method for preparing the high-performance rubber damping material includes: grafting hydroxyethyl methacrylate and lignin to a rubber molecular chain of natural rubber latex through graft copolymerization reaction, so as to obtain a high-performance rubber damping material. This method adopts natural rubber latex as a base material, the hydroxyethyl methacrylate and lignin are grafted to the rubber molecular chain of natural rubber latex through graft copolymerization reaction, to form a semi-interpenetrating network structure.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: May 30, 2023
    Assignee: Agricultural Products Processing Research Inst., Chinese Academy of Tropical Agricultural Sciences
    Inventors: Hongchao Liu, Heping Yu, Qifang Wang, Yongzhen Li, Zheng Peng
  • Publication number: 20210395423
    Abstract: The present disclosure discloses a high-performance rubber damping material and a method for preparing the same, relating to the technical field of damping materials. The method for preparing the high-performance rubber damping material includes: grafting hydroxyethyl methacrylate and lignin to a rubber molecular chain of natural rubber latex through graft copolymerization reaction, so as to obtain a high-performance rubber damping material. This method adopts natural rubber latex as a base material, the hydroxyethyl methacrylate and lignin are grafted to the rubber molecular chain of natural rubber latex through graft copolymerization reaction, to form a semi-interpenetrating network structure.
    Type: Application
    Filed: March 26, 2021
    Publication date: December 23, 2021
    Inventors: Hongchao LIU, Heping YU, Qifang WANG, Yongzhen LI, Zheng PENG