Abstract: A secondary alloyed 1N copper wire for bonding in microelectronics contains one or more corrosion resistance alloying materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance alloying materials is between about 0.09 wt % and about 9.9 wt %.

Abstract: An alloyed 2N copper wire for bonding in microelectronics contains 2N copper and one or more corrosion resistance alloying materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance alloying materials is between about 0.009 wt % and about 0.99 wt %.

Abstract: A 3N copper wire with trace additions for bonding in microelectronics contains 3N copper and one or more corrosion resistance addition materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance addition materials is between about 90 wt. ppm and about 980 wt. ppm.

Abstract: A bonding wire for semiconductor devices and a method of manufacturing the wire are provided. The bonding wire contains at least one element selected from zinc, tin, and nickel in an amount of 5 ppm to 10 wt %, the remainder containing silver and inevitable impurities. The method involves pouring a silver alloy according to the invention into a mold and melting the silver alloy, continuously casting the melted silver alloy, and drawing the continuously casted silver alloy.

Abstract: A metal fiber based on one or several elements from the group of platinum, palladium, rhodium, ruthenium, and iridium with 0 to 30% by weight of one or several additional alloy elements from the group of nickel, cobalt, gold, rhenium, molybdenum, and tungsten, contains 1 to 500 ppm by weight of boron or phosphorus. A non-woven material or netting, in particular for the production of nitrogen oxide or for the production of hydrocyanic acid, is made of such fibers. For the production of fibers based on noble metals having up to 30% by weight of additional alloy metals by drawing the fibers from a melt, the melting point of the metal is reduced by at least 400° C., before drawing of the fibers, by additionally alloying with boron or phosphorus, and the boron or the phosphorus is removed again from the fibers.