Patents by Inventor Herbert A. Knapp

Herbert A. Knapp has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230184885
    Abstract: A method of operating a monolithic microwave integrated circuit (MMIC) in a radar transmitter includes: sending a radio frequency (RF) signal to a power amplifier of the radar transmitter, where the power amplifier is controlled by a termination control signal, where when the termination control signal is de-asserted, the power amplifier is configured to pass the RF signal through the power amplifier for transmission by an RF antenna, where when the termination control signal is asserted, the power amplifier is configured to terminate the RF signal in the power amplifier; transmitting the RF signal by de-asserting the termination control signal; and after de-asserting the termination control signal, disabling transmission of the RF signal by: reducing a power of the RF signal; and asserting the termination control signal.
    Type: Application
    Filed: December 10, 2021
    Publication date: June 15, 2023
    Inventors: Herbert Knapp, Hao Li
  • Patent number: 10830868
    Abstract: A cascaded radar sensor arrangement is disclosed. The arrangement includes a first buffer and a second buffer. The first buffer is within a first radar chip and includes a switch and is configured to mitigate a first leakage signal in the disabled mode. The second buffer is within a second radar chip and has a disabled mode. The second radar chip is cascaded with the first radar chip. A control unit is coupled to the first radar chip and the second radar chip and is configured to set the disabled mode for the first buffer.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: November 10, 2020
    Assignee: Infineon Technologies AG
    Inventors: Hao Li, Herbert Knapp
  • Patent number: 10574367
    Abstract: One exemplary embodiment of the present invention relates to a circuit that includes at least one RF signal path for an RF signal and at least one power sensor, which is coupled to the RF signal path and configured to generate a sensor signal representing the power of the RF signal during normal operation of the circuit. The circuit further includes a circuit node for receiving an RF test signal during calibration operation of the circuit. The circuit node is coupled to the at least one power sensor, so that the at least one power sensor receives the RF test signal additionally or alternatively to the RF signal and generates the sensor signal as representing the power of the RF test signal.
    Type: Grant
    Filed: October 30, 2018
    Date of Patent: February 25, 2020
    Assignee: Infineon Technologies AG
    Inventors: Karl Dominizi, Oliver Frank, Herbert Jaeger, Herbert Knapp, Hao Li, Florian Starzer, Rainer Stuhlberger, Jonas Kammerer
  • Patent number: 10466339
    Abstract: An on-chip power sensor and a millimeter-wave communication device (e.g. transmitter or transceiver) on a chip including the on-chip power sensor are described. The millimeter-wave communication device can also include a coupler disposed on a transmit path, the coupler being configured to receive a transmit signal and to provide the transmit signal to an antenna connection (e.g. pad). The on-chip power sensor can be configured to receive a coupled portion of the transmit signal from the coupler, and measure a transmit power of the transmit signal based on the coupled portion of the transmit signal.
    Type: Grant
    Filed: November 12, 2018
    Date of Patent: November 5, 2019
    Assignee: Infineon Technologies AG
    Inventors: Jonas Kammerer, Herbert Knapp, Hao Li
  • Publication number: 20190094337
    Abstract: An on-chip power sensor and a millimeter-wave communication device (e.g. transmitter or transceiver) on a chip including the on-chip power sensor are described. The millimeter-wave communication device can also include a coupler disposed on a transmit path, the coupler being configured to receive a transmit signal and to provide the transmit signal to an antenna connection (e.g. pad). The on-chip power sensor can be configured to receive a coupled portion of the transmit signal from the coupler, and measure a transmit power of the transmit signal based on the coupled portion of the transmit signal.
    Type: Application
    Filed: November 12, 2018
    Publication date: March 28, 2019
    Applicant: Infineon Technologies AG
    Inventors: Jonas Kammerer, Herbert Knapp, Hao Li
  • Publication number: 20190068295
    Abstract: One exemplary embodiment of the present invention relates to a circuit that includes at least one RF signal path for an RF signal and at least one power sensor, which is coupled to the RF signal path and configured to generate a sensor signal representing the power of the RF signal during normal operation of the circuit. The circuit further includes a circuit node for receiving an RF test signal during calibration operation of the circuit. The circuit node is coupled to the at least one power sensor, so that the at least one power sensor receives the RF test signal additionally or alternatively to the RF signal and generates the sensor signal as representing the power of the RF test signal.
    Type: Application
    Filed: October 30, 2018
    Publication date: February 28, 2019
    Inventors: Karl DOMINIZI, Oliver FRANK, Herbert JAEGER, Herbert KNAPP, Hao LI, Florian STARZER, Rainer STUHLBERGER, Jonas WURSTHORN
  • Patent number: 10145938
    Abstract: An on-chip power sensor and a millimeter-wave transmitter on a chip including the on-chip power sensor are described. The millimeter-wave transmitter can also include a coupler disposed on a transmit path, the coupler being configured to receive a transmit signal and to provide the transmit signal to an antenna. The on-chip power sensor can be configured to receive a coupled portion of the transmit signal from the coupler, and measure a transmit power of the transmit signal based on the coupled portion of the transmit signal.
    Type: Grant
    Filed: August 31, 2016
    Date of Patent: December 4, 2018
    Assignee: Infineon Technologies AG
    Inventors: Jonas Wursthorn, Herbert Knapp, Hao Li
  • Patent number: 10128962
    Abstract: One exemplary embodiment of the present invention relates to a circuit that includes at least one RF signal path for an RF signal and at least one power sensor, which is coupled to the RF signal path and configured to generate a sensor signal representing the power of the RF signal during normal operation of the circuit. The circuit further includes a circuit node for receiving an RF test signal during calibration operation of the circuit. The circuit node is coupled to the at least one power sensor, so that the at least one power sensor receives the RF test signal additionally or alternatively to the RF signal and generates the sensor signal as representing the power of the RF test signal.
    Type: Grant
    Filed: May 3, 2016
    Date of Patent: November 13, 2018
    Assignee: Infineon Technologies AG
    Inventors: Karl Dominizi, Oliver Frank, Herbert Jaeger, Herbert Knapp, Hao Li, Florian Starzer, Rainer Stuhlberger, Jonas Wursthorn
  • Publication number: 20180156890
    Abstract: A cascaded radar sensor arrangement is disclosed. The arrangement includes a first buffer and a second buffer. The first buffer is within a first radar chip and includes a switch and is configured to mitigate a first leakage signal in the disabled mode. The second buffer is within a second radar chip and has a disabled mode. The second radar chip is cascaded with the first radar chip. A control unit is coupled to the first radar chip and the second radar chip and is configured to set the disabled mode for the first buffer.
    Type: Application
    Filed: February 2, 2018
    Publication date: June 7, 2018
    Inventors: Hao Li, Herbert Knapp
  • Patent number: 9941911
    Abstract: A mixing stage includes a first modulation stage that receives an input signal from a first common node of the mixing stage, a first local oscillator input that receives a local oscillator signal, and a first modulation signal output adapted to provide a first modulated signal. A second modulation stage of the mixing stage includes a second input that receives a phase inverted representation of the input signal from a second common node of the mixing stage, a second local oscillator input that receives the local oscillator signal, and a second modulation signal output adapted to provide a second modulated signal. A current generation circuit provides a supply current to the first common node and to the second common node. A current control circuit is adapted to superimpose an offset current to the current of at least one node of the first common node and the second common node.
    Type: Grant
    Filed: May 31, 2017
    Date of Patent: April 10, 2018
    Assignee: Infineon Technologies AG
    Inventors: Saverio Trotta, Herbert Knapp
  • Patent number: 9910133
    Abstract: A cascaded radar sensor arrangement is disclosed. The arrangement includes a first buffer and a second buffer. The first buffer is within a first radar chip and includes a switch and is configured to mitigate a first leakage signal in the disabled mode. The second buffer is within a second radar chip and has a disabled mode. The second radar chip is cascaded with the first radar chip. A control unit is coupled to the first radar chip and the second radar chip and is configured to set the disabled mode for the first buffer.
    Type: Grant
    Filed: February 25, 2015
    Date of Patent: March 6, 2018
    Assignee: Infineon Technologies AG
    Inventors: Hao Li, Herbert Knapp
  • Publication number: 20170264323
    Abstract: A mixing stage includes a first modulation stage that receives an input signal from a first common node of the mixing stage, a first local oscillator input that receives a local oscillator signal, and a first modulation signal output adapted to provide a first modulated signal. A second modulation stage of the mixing stage includes a second input that receives a phase inverted representation of the input signal from a second common node of the mixing stage, a second local oscillator input that receives the local oscillator signal, and a second modulation signal output adapted to provide a second modulated signal. A current generation circuit provides a supply current to the first common node and to the second common node. A current control circuit is adapted to superimpose an offset current to the current of at least one node of the first common node and the second common node.
    Type: Application
    Filed: May 31, 2017
    Publication date: September 14, 2017
    Inventors: Saverio Trotta, Herbert Knapp
  • Patent number: 9748984
    Abstract: A mixing stage includes a first modulation stage that receives an input signal from a first common node of the mixing stage, a first local oscillator input that receives a local oscillator signal, and a first modulation signal output adapted to provide a first modulated signal. A second modulation stage of the mixing stage includes a second input that receives a phase inverted representation of the input signal from a second common node of the mixing stage, a second local oscillator input that receives the local oscillator signal, and a second modulation signal output adapted to provide a second modulated signal. A current generation circuit provides a supply current to the first common node and to the second common node. A current control circuit is adapted to superimpose an offset current to the current of at least one node of the first common node and the second common node.
    Type: Grant
    Filed: July 28, 2016
    Date of Patent: August 29, 2017
    Assignee: Infineon Technologies AG
    Inventors: Saverio Trotta, Herbert Knapp
  • Patent number: 9673845
    Abstract: A mixing stage includes a first modulation stage that receives an input signal from a first common node of the mixing stage, a first local oscillator input that receives a local oscillator signal, and a first modulation signal output adapted to provide a first modulated signal. A second modulation stage of the mixing stage includes a second input that receives a phase inverted representation of the input signal from a second common node of the mixing stage, a second local oscillator input that receives the local oscillator signal, and a second modulation signal output adapted to provide a second modulated signal. A current generation circuit provides a supply current to the first common node and to the second common node. A current control circuit is adapted to superimpose an offset current to the current of at least one node of the first common node and the second common node.
    Type: Grant
    Filed: May 13, 2015
    Date of Patent: June 6, 2017
    Assignee: Infineon Technologies AG
    Inventors: Saverio Trotta, Herbert Knapp
  • Patent number: 9667357
    Abstract: The present invention relates to a millimeter-wave transmitter on a chip comprising at least one transmit path coupleable to an oscillator, and an on-chip power sensor to measure at least a portion of a transmit power transmitted over the at least one transmit path. The present invention further relates to a method of calibrating a millimeter-wave transmitter on a chip and an on-chip power sensor coupleable to at least one transmit path of a millimeter-wave transmitter. The embodiments of the present invention provide a direct measure of transmit power provided within an individual one of the transmit paths of the millimeter-wave transmitter.
    Type: Grant
    Filed: April 26, 2014
    Date of Patent: May 30, 2017
    Assignee: Infineon Technologies AG
    Inventors: Herbert Knapp, Jonas Wursthorn
  • Patent number: 9614626
    Abstract: The present invention relates to a millimeter-wave transmitter on a chip comprising at least one transmit path coupleable to an oscillator, and an on-chip power sensor to measure at least a portion of a transmit power transmitted over the at least one transmit path. The present invention further relates to a method of calibrating a millimeter-wave transmitter on a chip and an on-chip power sensor coupleable to at least one transmit path of a millimeter-wave transmitter. The embodiments of the present invention provide a direct measure of transmit power provided within an individual one of the transmit paths of the millimeter-wave transmitter.
    Type: Grant
    Filed: April 26, 2014
    Date of Patent: April 4, 2017
    Assignee: Infineon Technologies AG
    Inventors: Herbert Knapp, Jonas Wursthorn
  • Publication number: 20160370458
    Abstract: An on-chip power sensor and a millimeter-wave transmitter on a chip including the on-chip power sensor are described. The millimeter-wave transmitter can also include a coupler disposed on a transmit path, the coupler being configured to receive a transmit signal and to provide the transmit signal to an antenna. The on-chip power sensor can be configured to receive a coupled portion of the transmit signal from the coupler, and measure a transmit power of the transmit signal based on the coupled portion of the transmit signal.
    Type: Application
    Filed: August 31, 2016
    Publication date: December 22, 2016
    Applicant: InfineonTechnologies AG
    Inventors: Jonas Wursthorn, Herbert Knapp, Hao Li
  • Publication number: 20160336978
    Abstract: A mixing stage includes a first modulation stage that receives an input signal from a first common node of the mixing stage, a first local oscillator input that receives a local oscillator signal, and a first modulation signal output adapted to provide a first modulated signal. A second modulation stage of the mixing stage includes a second input that receives a phase inverted representation of the input signal from a second common node of the mixing stage, a second local oscillator input that receives the local oscillator signal, and a second modulation signal output adapted to provide a second modulated signal. A current generation circuit provides a supply current to the first common node and to the second common node. A current control circuit is adapted to superimpose an offset current to the current of at least one node of the first common node and the second common node.
    Type: Application
    Filed: July 28, 2016
    Publication date: November 17, 2016
    Inventors: Saverio Trotta, Herbert Knapp
  • Patent number: 9496824
    Abstract: The disclosure provides an oscillator circuit for a voltage controlled oscillator. The oscillator circuit includes first and second coupled transmission lines, wherein the oscillator circuit is configured to provide a variable load impedance at a first end of a signal line of the first transmission line such that a variable inductance is provided between first and second ends of a signal line of the second transmission line in dependence on the variable load impedance. The oscillator circuit is configured to adjust the variable inductance provided between the first and second ends of the signal line of the second transmission line by adjusting the variable load impedance provided at the first end of the signal line of the first transmission line, wherein the variable inductance provided between the first and second ends of the signal line of the second transmission line constitutes a frequency determining element of the oscillator circuit.
    Type: Grant
    Filed: September 22, 2015
    Date of Patent: November 15, 2016
    Assignee: Infineon Technologies AG
    Inventors: Hao Li, Jidan Al-Eryani, Herbert Knapp
  • Publication number: 20160329972
    Abstract: One exemplary embodiment of the present invention relates to a circuit that includes at least one RF signal path for an RF signal and at least one power sensor, which is coupled to the RF signal path and configured to generate a sensor signal representing the power of the RF signal during normal operation of the circuit. The circuit further includes a circuit node for receiving an RF test signal during calibration operation of the circuit. The circuit node is coupled to the at least one power sensor, so that the at least one power sensor receives the RF test signal additionally or alternatively to the RF signal and generates the sensor signal as representing the power of the RF test signal.
    Type: Application
    Filed: May 3, 2016
    Publication date: November 10, 2016
    Inventors: Karl DOMINIZI, Oliver Frank, Herbert Jaeger, Herbert Knapp, Hao Li, Florian Starzer, Rainer Stuhlberger, Jonas Wursthorn