Patents by Inventor Herbert Breidenbach

Herbert Breidenbach has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4990395
    Abstract: Electrically conductive copper layers in conductor plates and electrical components having a black metal coating which is acid-soluble and capable of being applied in an acidic medium are more easily prepared and have superior properties. In the process of preparation, such conductor plates provided with a resist and, optionally, with through-contacts, and having free copper areasa) are galvanically coated with a coating of a black metal in an acidic medium;b) the resist is removed and then the copper areas having been exposed thereby are removed by etching;c) the conductor plates are provided with an adhering solder mask;d) at those parts that are not covered by the solder mask the black metal coating is removed and, if desired, the copper areas exposed thereby are provided with a well solderable metal layer.
    Type: Grant
    Filed: May 16, 1988
    Date of Patent: February 5, 1991
    Assignee: Blasberg Oberflachentechnik GmbH
    Inventors: Jurgen Hupe, Frank Sonnenschein, Herbert Breidenbach
  • Patent number: 4750976
    Abstract: Electrically conductive copper layers in conductor plates and electrical components having a black metal coating which is acid-soluble and capable of being applied in an acidic medium are more easily prepared and have superior properties. In the process of preparation, such conductor plates provided with a resist and, optionally, with through-contacts, and having free copper areas(a) are galvanically coated with a coating of a black metal in an acidic medium;(b) the resist is removed and then the copper areas having been exposed thereby are removed by etching;(c) the conductor plates are provided with an adhering solder mask;(d) at those parts that are not covered by the solder mask the black metal coating is removed and, if desired, the copper areas exposed thereby are provided with a well solderable metal layer.
    Type: Grant
    Filed: December 9, 1985
    Date of Patent: June 14, 1988
    Assignee: Blasberg Oberflachentechnik GmbH
    Inventors: Jurgen Hupe, Frank Sonnenschein, Herbert Breidenbach