Patents by Inventor Herbert De Pauw

Herbert De Pauw has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compressible Electrode
    Publication number: 20230175899
    Abstract: The present invention provides a compressible electrode comprising a stably deformable polymer layer comprising a first outer surface, a second outer surface and at least one deformed portion formed as at least one indentation in the first outer surface and at least one corresponding protrusion in the second outer surface, and at least one non-deformed portion. The electrode further comprises at least one stretchable conductor layer arranged on or within the stably deformable polymer layer at the deformed portion and/or at the non-deformed portion. Further, the stably deformable polymer layer is stably deformed at the at least one deformed portion. The electrode further comprises an elastic material arranged on the first outer surface such that the elastic material fills the at least one indentation.
    Type: Application
    Filed: May 26, 2021
    Publication date: June 8, 2023
    Inventors: Jan Vanfleteren, Herbert De Pauw, Matthias Willockx, Hugo De Winter, Sofie Moorkens
  • Low cost electroless plating process for single chips and wafer parts and products obtained thereof
    Patent number: 6548327
    Abstract: The present invention is related to a method for electroless plating Nickel/Gold on aluminium bonding pads of single chips or wafer parts. This method result in uniformly plated singulated chips, single dice or wafer parts in a much more simple and cost-effective way. The proposed method comprises the steps of attaching to die or wafer part to a non-conductive adhesive or substrate.
    Type: Grant
    Filed: April 24, 2001
    Date of Patent: April 15, 2003
    Assignees: Interuniversitair Microelektronica Centrum, vzw, Universiteit Gent
    Inventors: Herbert De Pauw, Jan Vanfleteren, Suixin Zhang
  • Low cost electroless plating process for single chips and wafer parts and products obtained thereof
    Publication number: 20020001670
    Abstract: The present invention is related to a method for electroless plating Nickel/Gold on aluminium bonding pads of single chips or wafer parts. This method result in uniformly plated singulated chips, single dice or wafer parts in a much more simple and cost-effective way. The proposed method comprises the steps of attaching to die or wafer part to a non-conductive adhesive or substrate.
    Type: Application
    Filed: April 24, 2001
    Publication date: January 3, 2002
    Inventors: Herbert De Pauw, Jan Vanfleteren, Suixin Zhang