Abstract: A method of making and electrically interconnecting layers of printed circuitry involves the steps of: (1) coating an insulator on both sides with an adhesive; (2) punching holes through the insulator at points where interconnections are to be made; (3) laminating conductor planes to both sides of the insulator by means of the adhesive; (4) forming printed circuit patterns on the conductors such that a proper conductor geometry is created at the points where the interconnections are to be made; (5) applying pre-punched, adhesive-coated cover layers of insulation over the exposed printed circuits, except in the area of the interconnections; and (6) applying solder to the conductor pattern. Since the geometry at the interconnections is carefully controlled a solder bridge is formed, which connects the two conductor patterns during step (6) by the flow of solder into the interconnection area, past the upper conductor, to the lower conductor.