Abstract: In a method of reversably storing hydrogen in a hydrogen reservoir including a hydrogen storage material disposed between an electrode and a counter electrode, the hydrogen storage material is charged with hydrogen and the hydrogen is recuperated from the hydrogen storage material by applying between the electrodes a voltage differential to generate a current flow across the electrolyte which is adjustable for controlling the rate of release of the hydrogen from the hydrogen storage material.

Abstract: In a method of reversably storing hydrogen in a hydrogen reservoir including a hydrogen storage material disposed between an electrode and a counter electrode, the hydrogen storage material is charged with hydrogen and the hydrogen is recuperated from the hydrogen storage material by applying between the electrodes a voltage differential to generate a current flow across the electrolyte which is adjustable for controlling the rate of release of the hydrogen from the hydrogen storage material.

Abstract: An apparatus having a percolating, sponge-like nanoparticulate layer, the apparatus being suitable for numerous technical applications. The object is accomplished by an apparatus having an electrode and a sponge-like, percolating, electrically-conductive layer comprising bound nanoparticles, the layer containing cavities and at least partially covering the electrode. The size of the nanoparticles is at most 15 times the size of a forming space-charge region in the layer; the cavities in the layer are at least partially filled with an electrolyte. The cavities of the layer are larger than the space-charge region in the electrolyte. The electrolyte also forms a film, which borders the surface of the layer located opposite the electrode. The apparatus also includes elements with which a voltage can be applied between the electrode and the electrolyte.

Abstract: A highly sensitive strain gage containing a thin discontinuous metal layer whose conduction effect is based predominantly on the tunnel effect and which is applied uniformly onto a thin, nonmetallic, dielectric or semiconducting substrate such as uniaxially oriented or partially crystalline plastic film, an ordered ultrathin layer or a silicone-coated plastic film, the diffusion processes in the applied metal layer being reduced and its structural stability improved as a result of interaction of the substrate with the metal layer.