Abstract: A hydraulic system (e.g., of an aircraft or other vehicle) includes a pump, a pressure line coupled to the pump and configured to distribute pressurized hydraulic fluid, and a return line configured to return hydraulic fluid to a reservoir. The hydraulic system also includes an auxiliary leakage valve coupled to the pressure line, to the return line, and to an actuator. The auxiliary leakage valve is configured to receive a control signal and, based on the control signal, selectively open a restricted fluid path. The restricted fluid path couples the pressure line to the return line to allow a restricted amount of the hydraulic fluid to flow from the pressure line to the return line.

Abstract: A hydraulic system (e.g., of an aircraft or other vehicle) includes a pump, a pressure line coupled to the pump and configured to distribute pressurized hydraulic fluid, and a return line configured to return hydraulic fluid to a reservoir. The hydraulic system also includes an auxiliary leakage valve coupled to the pressure line, to the return line, and to an actuator. The auxiliary leakage valve is configured to receive a control signal and, based on the control signal, selectively open a restricted fluid path. The restricted fluid path couples the pressure line to the return line to allow a restricted amount of the hydraulic fluid to flow from the pressure line to the return line.

Abstract: The invention relates to a composite structure for electronic microsystems and a method for producing this composite structure, with the composite structure being provided with a polycrystalline diamond layer (4) for heat withdrawal. The growth substrate (1) contains or forms a component layer (2) with the electronic microsystems, which are provided with binary or higher order component compound semiconductors. A protective layer (3), which encloses the component layer at least indirectly almost entirely, is placed between the component layer 2 and the diamond layer (4). A material is selected for the protective layer whose reactivity with the precursor materials present in the deposition of the diamond layer (4) by means of CVD, preferably by means of plasma CVD, is smaller than that of the component layer (2), and said protective layer.

Abstract: The invention relates to a composite structure for electronic Microsystems and a method for producing this composite structure, with the composite structure being provided with a polycrystalline diamond layer (4) for heat withdrawal. The growth substrate (1) contains or forms a component layer (2) with the electronic Microsystems, which are provided with binary or higher order component compound semiconductors. A protective layer (3), which encloses the component layer at least indirectly almost entirely, is placed between the component layer 2 and the diamond layer (4). A material is selected for the protective layer whose reactivity with the precursor materials present in the deposition of the diamond layer (4) by means of CVD, preferably by means of plasma CVD, is smaller than that of the component layer (2), and said protective layer.