Patents by Inventor Herbert Hutter

Herbert Hutter has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10910284
    Abstract: A semiconductor device includes a first semiconductor component having a semiconductor substrate, and a barrier layer disposed at least on or at a portion of the first semiconductor component. The barrier layer includes a polymer material and an organic metal complexing agent covalently bound to the polymer material. In an embodiment, the organic metal complexing agent includes a crown ether and/or cryptand. In an embodiment, the polymer material includes a homopolymer or copolymer resulting from the polymerization of monomers selected from the group consisting of: imides, epoxies, silicones, monomers having functional side chains, methacrylates, and any combinations thereof.
    Type: Grant
    Filed: December 7, 2016
    Date of Patent: February 2, 2021
    Assignee: Infineon Technologies Austria AG
    Inventors: Stefan Schwab, Herbert Hutter
  • Publication number: 20170162461
    Abstract: A semiconductor device is provided. The semiconductor device includes a first semiconductor component having a semiconductor substrate, and a barrier layer disposed at least on or at a portion of the first semiconductor component. The barrier layer includes a polymer material and an organic metal complexing agent covalently bound to the polymer material.
    Type: Application
    Filed: December 7, 2016
    Publication date: June 8, 2017
    Inventors: Stefan Schwab, Herbert Hutter