Patents by Inventor Herbert Iwan

Herbert Iwan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for manufacturing through-hole contacting plated printed circuit
    Patent number: 5145572
    Abstract: The process for manufacturing through-hole contacting plated printed circuit boards by direct metal electrodeposition on catalytically activated surfaces of the substrate material is improved by pre-treatment prior to electrodepositing the metal, preferably with a solution containing one or more nitrogen-containing organic compounds.
    Type: Grant
    Filed: December 9, 1991
    Date of Patent: September 8, 1992
    Assignee: Blasberg Oberflachentechnik GmbH
    Inventors: Jurgen Hupe, Herbert Iwan