Abstract: Permanent physical and electrical attachment of electrically conductive contacts of a first component in a RFID device, such as a smart card or smart inlay, is made to the electrically conductive contacts of a second component of the device, for example, a conductive area, such as an antenna. Attachment is achieved by co-depositing metal and electrically conductive hard particles upon the conductive contacts of either the first or second components and then using a non-conductive adhesive to provide permanent bond between the components and their conductive contacts.

Abstract: The disclosed invention relates to materials and processes for creating particle-enhanced bumps on electrical contact surfaces through stencil or screen printing processes. The materials are mixtures of conductive ink, conductive paste, or conductive adhesive and conductive hard particles (104). The process involves depositing the mixture (108) onto electrical contact surfaces by stencil printing, screen printing, or other dispensing techniques (110). In another embodiment, the ink, paste, or adhesive is first stenciled or screen printed and the particles are then applied on top of the ink, paste, or adhesive deposit. Once cured (114), the deposition provides a hard, electrical contact bump on the contact surface with a rough, conductive, sandpaper-like surface that can be easily connected to an opposing contact surface without any further surface preparation of either surface.

Abstract: The present invention provides a unique method for the electroless co-deposition of metal and hard particles on an electrical contact surface to provide electrical, thermal, and mechanical connections between the particle enhanced contact surface and an opposing contact surface, and to enhance the thermal and electrical conductivity between the contact surfaces and their corresponding substrates. The innovative method is able to uniformly deposit metal and particles of any shape, and with a wide range of density and sizes, on contact surfaces, and can be adjusted to provide any desired surface area coverage in desirable deposition patterns. The co-deposited contact surface can, for example, be easily joined to another surface of any type by nonconductive adhesive, resulting in a connection that is mechanically robust, chemically inert, and inherently electrically conductive.

Abstract: The present invention provides a unique method for the electroless co-deposition of metal and hard particles on an electrical contact surface to provide electrical, thermal, and mechanical connections between the particle enhanced contact surface and an opposing contact surface, and to enhance the thermal and electrical conductivity between the contact surfaces and their corresponding substrates. The innovative method is able to uniformly deposit metal and particles of any shape, and with a wide range of density and sizes, on contact surfaces, and can be adjusted to provide any desired surface area coverage in desirable deposition patterns. The co-deposited contact surface can, for example, be easily joined to another surface of any type by nonconductive adhesive, resulting in a connection that is mechanically robust, chemically inert, and inherently electrically conductive.

Abstract: An optical device module, for example, an LED array module or photosensor module, includes a plurality of optical devices electrically attached to contact lands on a substrate by a plurality of electrically conductive hard particles and mechanically attached by a non-electrically conductive bonding adhesive. The optical device module may further include a cover that is transparent to the light emitted or detected by the optical devices and that has electrically conductive contact pads on an inner surface thereof, which are bonded to bond pads on a face surface of the optical devices. A process for fabricating an optical device module includes electrically connecting the optical device to the electrical contact land on the substrate by attaching a plurality of electrically conductive hard particles to either the base surface of the optical device or to the electrical contact lands.

Abstract: The invention provides a method for permanently physically and electrically attaching the electrically conductive contacts of a first component in a RFID device, such as a smart card or smart inlay, to the electrically conductive contacts of a second component of the device. Attachment is made between the first and second components of the device by co-depositing metal and electrically conductive hard particles upon the conductive contacts of either the first or second components and using a non-conductive adhesive to provide permanent bond between the components and their conductive contacts. Components of an RFID device may include, for example, a memory chip, a microprocessor chip, a transceiver, or other discrete or integrated circuit device, a chip carrier, a chip module, and a conductive area, e.g., an antenna.

Abstract: An electrical component assembly and method for the fabrication of the assembly in which particles are affixed to metal contact surfaces and pressure is applied to cause the particles to penetrate into at least one of the metal contact surfaces. In one method, hard particles are applied to one of the metal surfaces by electroplating the particles in a plating bath. In another method, the hard particles are applied to a non-conductive adhesive layer positioned between an electronic component and a substrate. Once pressure is applied to either the electronic component on the substrate, a permanent, electrically conductive bond is formed.

Abstract: A chemical resistant copolymer useful in electronic applications, said copolymer is a polyimide containing a 3,3',4,4'-tetracarboxybiphenyl dianhydride (BPDA) moiety, at least one other dianhydride moiety, and at least one diamine.

Abstract: A polyimide layer having a thickness greater than about 5 microns is formed on a substrate by coating a substrate with a solution of polymer and a solvent of the formula ##STR1## wherein R.sub.1 and R.sub.2 are independently a hydrogen, a C.sub.1 to C.sub.6 alkyl moiety, or a ##STR2## R.sub.5 is a C.sub.1 to C.sub.6 alkyl moiety; and R.sub.3 and R.sub.4 are independently hydrogen or a C.sub.1 to C.sub.6 alkyl moiety, and curing the resulting coated substrate.