Patents by Inventor Herbert Januschkowetz

Herbert Januschkowetz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4371573
    Abstract: The electroless deposition of nickel coatings on metals and metal alloy is accomplished with aqueous baths which contain 10-50 g/l of a fluorine-containing nickel compound; 40 to 200 g/l diammonium hydrogen citrate; 20 to 100 g/l ammonium hydrogen difluoride; 5 to 50 g/l 2-hydroxy-4-methyl benzoic acid, (2,4-cresotinic acid); 0.0005-0.05 g/l copper salt; and 10-100 g/l sodium hypophosphite. Nickel fluoride and nickel (II)-hydroxide carbonate dissolved in hydrofluoric acid have been found particularly advantageous. Smooth and uniform, corrosion-resistant coatings are obtained also on complicated formed parts of magnesium and magnesium alloys.
    Type: Grant
    Filed: November 18, 1981
    Date of Patent: February 1, 1983
    Assignee: Siemens Aktiengesellschaft
    Inventors: Herbert Januschkowetz, Hans Laub
  • Patent number: 4036707
    Abstract: A method for metallizing a thermosetting resin is provided comprising:A. etching the surface of said resin with an oxidizing acid;B. activating the surface of said resin with a stannous chloride solution;C. sensitizing said resin in an aqueous solution of from 0.1 to 0.5 g per liter of palladium chloride and 1 to 6 ml of concentrated hydrochloric acid per liter;D. immersing said resin at about 90.degree. C in an accelerator bath having a pH of about 7, said bath containing sodium hypophosphite, trisodium citrate, ammonium chloride and 2,4-dihydroxy benzoic acid;E. electrolessly nickel-plating said resin at a temperature of between about 96.degree. to 99.degree. C in a fast-depositing nickel bath having a pH of about 6.5 to 6.9 to form a nickel layer;F. electroplating said nickel layer with copper; andG. metallizing said copper layer to form a metallized layer.
    Type: Grant
    Filed: August 19, 1976
    Date of Patent: July 19, 1977
    Assignee: Siemens Aktiengesellschaft
    Inventors: Herbert Januschkowetz, Hans Laub