Abstract: A method and apparatus for positioning, holding and moving formed adhesive elements (40) to a heated bonding part (42) are disclosed. The apparatus includes a hopper (12) movably positioned over a matrix plate (14). The matrix plate includes a nesting matrix (18) defined by formed adhesive element-receiving apertures (22). An ejector system (20) is fitted beneath the matrix plate and includes a body (24) having a vacuum chamber (26) with an air inlet (28) and an air exhaust (30). The chamber is fluidly continuous with the apertures formed in the matrix plate (14). The ejector system includes a lifting body to which ejector stamps (34, 34?) and an inlet shut off shaft are attached. Channels for the ejector stamps are formed in the body of the ejector system. The ejector stamps are movably fitted in the apertures and the channels. In operation, the hopper (12) slides over the matrix and deposits formed adhesive elements into the apertures (22), then slides away.

Abstract: A manually operated or automated bonding tool for the attachment of a formed adhesive element to a bonding part is disclosed. The bonding tool includes a loading module in which the bare bonding part is loaded, an oven module in which the bare bonding part is heated, an adhesive picking station module in which the adhesive is attached to the heated bare bonding part, and a part transfer module which advances the bare bonding part sequentially from the loading module, through the oven module, and to the adhesive picking station module. The oven module includes an elongated heating block having a bonding part guide by which the bare bonding parts are transferred through the oven and to the adhesive picking station module. The part transfer module is used to push the unheated bare bonding part into and through the oven module and into position on the adhesive picking station module.

Abstract: A method and apparatus for positioning, holding and moving formed adhesive elements (40) to a heated bonding part (42) are disclosed. The apparatus includes a hopper (12) movably positioned over a matrix plate (14). The matrix plate includes a nesting matrix (18) defined by formed adhesive element-receiving apertures (22). An ejector system (20) is fitted beneath the matrix plate and includes a body (24) having a vacuum chamber (26) with an air inlet (28) and an air exhaust (30). The chamber is fluidly continuous with the apertures formed in the matrix plate (14). The ejector system includes a lifting body to which ejector stamps (34,34?) and an inlet shut off shaft are attached. Channels for the ejector stamps are formed in the body of the ejector system. The ejector stamps are movably fitted in the apertures and the channels. In operation, the hopper (12) slides over the matrix and deposits formed adhesive elements into the apertures (22) then slides away.

Abstract: A manually operated or automated bonding tool for the attachment of a formed adhesive element to a bonding part is disclosed. The bonding tool includes a loading module in which the bare bonding part is loaded, an oven module in which the bare bonding part is heated, an adhesive picking station module in which the adhesive is attached to the heated bare bonding part, and a part transfer module which advances the bare bonding part sequentially from the loading module, through the oven module, and to the adhesive picking station module. The oven module includes an elongated heating block having a bonding part guide by which the bare bonding parts are transferred through the oven and to the adhesive picking station module. The part transfer module is used to push the unheated bare bonding part into and through the oven module and into position on the adhesive picking station module.

Abstract: A manually operated or automated bonding tool for the attachment of a formed adhesive element to a bonding part is disclosed. The bonding tool includes a loading module in which the bare bonding part is loaded, an oven module in which the bare bonding part is heated, an adhesive picking station module in which the adhesive is attached to the heated bare bonding part, and a part transfer module which advances the bare bonding part sequentially from the loading module, through the oven module, and to the adhesive picking station module. The modules are mounted on a base plate. The loading module includes a bare bonding part-retaining aperture formed in its top and an adjacent finger notch. The oven module receives the unheated bare bonding part from the loading module.