Abstract: An apparatus for selectively jet etching a plastic which is encapsulating an article (i.e., a device, assembly, and the like). This apparatus accomplishes the elimination of the prior art problems and disadvantages by confining the etching to a preselected portion (i.e., the desired region) of the plastic encapsulation, by causing a turbulent flow of the etchant which in turn causes great mechanical agitation of the etchant and thereby results in complete etching of the plastic encapsulant, and by providing a completely closed systemic apparatus which thereby inherently precludes any danger to the personnel using the inventive apparatus.