Abstract: A thermal and acoustic insulating plate comprising an aminoplastic resin and a fiber reinforcement embedded therein in the form of a non-woven body of glass fibers extending uniformly throughout the entire volume of the plate. In preparing the plate a non-woven body of glass fibers is impregnated with aminoplastic resin, whereafter the resulting structure is expanded and cured in a mould by supplying heat energy thereto.

Abstract: A wood chip board the binder of which is an aminoplast, the amount of solid resin binder in the area of the surfaces of the board being less than 8% by weight of the chip material (absolutely dry) and the amount of solid resin binder in the area of the center of the board being equal or higher than in the area of the surfaces of the board as a percentage of the chip material in the center of the board. In preparing such a board the chip material providing the surfaces is advantageously glued with a liquor of an aminoplast the concentration of which is about 10 to 35% and preferably about 20 to 30%.

Abstract: The invention relates to a process for the production of a melamine resin coated paper for the formation of hot-molded, scratch resistant surface layers on laminate synthetic substances and wooden working materials, whereby the paper is preimpregnated with a urea resin or an aminoplast rich in urea and is then provided with an application of a melamine resin. At the same time, a solution of a resin is used for the preimpregnation of the paper, the degree of condensation of which is higher than the degree of condensation of the melamine resin to be used for the formation of the cover layer, and the preimpregnation is dried hot, to an extent that the preimpregnation resin is hardened to the point it is practically no longer soluble in the melamine resin.