Abstract: Fluidic channels and pumps for active cooling of cables are described. One cable assembly includes a conductor having a length between a first end of the cable and a second end of the cable and a fluidic channel structure that at least partially surrounds the conductor along the length of the conductor. A first pump connector is coupled to a first end of the fluidic channel structure and a second pump connector is coupled to a second end of the fluidic channel structure. Motion of liquid metal, when pumped through the fluidic channel structure, distributes heat away from the conductor.

Abstract: Systems, apparatuses, and methods provide simulations to vehicles, such as unmanned aerial vehicles (UAVs) equipped with stereoscopic cameras. The system can include a plurality of screens set at predetermined angles to provide proper parallax to the stereoscopic cameras. The system can also include a test computer to update the screens based on the actions and travel time of the UAV. The test computer can also monitor the load on the computing systems of the UAV due to the camera and other inputs. The system can enable the testing and configuration of cameras and sensors without requiring actual flight. The test computer can provide navigational information to the UAV, receive actions taken by the UAV, update the screens based on these actions and the travel speed and direction of the UAV, and monitor the effects of the cameras and other sensors on the internal components of the UAV during use.

Abstract: Microfluidic channels and pumps for active cooling of circuit boards are described. One circuit board includes a substrate and a microfluidic channel structure disposed on the substrate, the microfluidic channel structure comprising liquid metal disposed in a microfluidic channel. Liquid metal is disposed in the microfluidic channel and a pump pumps the liquid metal through the microfluidic channel to actively cool at least a portion of the circuit board.

Abstract: Microfluidic channels and pumps for active cooling of circuit boards are described. One circuit board includes a substrate and a microfluidic channel structure disposed on the substrate, the microfluidic channel structure comprising liquid metal disposed in a microfluidic channel. Liquid metal is disposed in the microfluidic channel and a pump pumps the liquid metal through the microfluidic channel to actively cool at least a portion of the circuit board.

Abstract: Fluidic channels and pumps for active cooling of cables are described. One cable assembly includes a conductor having a length between a first end of the cable and a second end of the cable and a fluidic channel structure that at least partially surrounds the conductor along the length of the conductor. A first pump connector is coupled to a first end of the fluidic channel structure and a second pump connector is coupled to a second end of the fluidic channel structure. Motion of liquid metal, when pumped through the fluidic channel structure, distributes heat away from the conductor.