Abstract: The method comprises the steps of plating at least one surface of the substrate with a metal with the one surface of the substrate to be bonded to a given surface of the metallic carrier, forming a plurality of vent holes in the given surface, tinning the plated one surface and the given surface separately with solder, cleaning the tinned plated one surface and the tinned given surface separately to clean both of the tinned surfaces, applying a flux to both of the cleaned tinned surfaces separately, placing both of the fluxed cleaned tinned surfaces in contact with each other, applying heat and pressure simultaneously to both of the substrate and the carrier until the solder of both of the fluxed cleaned tinned surfaces flows, and cooling both of the substrate and the carrier in a natural manner to room temperature while still applying the pressure to both the substrates to the carrier.