Abstract: Heat shrinkable tubing is disclosed which provides cushioning and vibration damping particularly useful for hand held power driven equipment. The tubing is extruded with internal ridges running along its entire length, which when heat shrunk on a substrate provides air pockets for cushioning and vibration damping. Embodiments disclosed include multiple layers of such material and multiple layers with smooth and texturized layers extruded concentrically on the primary vibration damping layers.

Abstract: A heat shrinkable tubing is described which has a texturized surface. Upon applying the heat shrinkable tubing to a complex shaped object and applying heat the tubing shrinks radially and linearly, uniformly so as to preserve the texturized friction surface, shrinking over depressions and expansions of the complex surface without wrinkling.

Abstract: A heat shrinkable tubing is described which has a texturized surface. Upon applying the heat shrinkable tubing to a complex shaped object and applying heat the tubing shrinks radially and linearly, uniformly so as to preserve the texturized friction surface, shrinking over depressions and expansions of the complex surface without wrinkling.

Abstract: An improved high dielectric strength unitary insulation sleeving is described. The insulation sleeving comprises an inner insulating layer such as woven fiberglass overcoated with an insulation resin such as an acrylic resin, having an additional insulating layer such as fiberglass overbraided upon it. The overbraided layer is secured to the inner resin-sleeving member by means of an additional impregnation with an electrically insulating binder resin, such as acrylic, to secure the composite together. This material, in addition to having the requisite mechanical and electrical properties for use on coil leads, is specifically adapted to VPI processing and can be utilized reliably with minimal effort. For example, the material has comparable and, in some instances, superior dielectric breakdown voltages as compared to conventionally used sleeving and is not subject to layer slippage which can decrease electrical properties, as can occur with conventionally used materials.