Abstract: In a method for fastening a semiconductor body provided with at least one component to a substrate, an under side of the semiconductor body is provided with a first contacting layer and with a powdered metal layer covering this first contacting layer. An upper side of the substrate is provided with a second contacting layer. The coated surfaces of the semiconductor body and of the substrate are then pressed together while being heated. When the semiconductor body is composed of a part of a semiconductor wafer that comprises a plurality of identical or similar parts, then the first contacting layer and the powdered metal layer of the invention are applied in common on the back side of the semiconductor wafer for all semiconductor bodies.