Patents by Inventor Herbert Stanley Cole, Jr.

Herbert Stanley Cole, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronics module having high density interconnect structures incorporating an improved dielectric lamination adhesive
    Patent number: 6294741
    Abstract: A multi-chip electronics module is provided which utilizes benzocyclobutene as a laminate adhesive for bonding the upper dielectric films in a high density interconnect structure. The benzocyclobutene thermosetting polymer is spin coated on a polyimide film, and baked at low temperature to remove any solvent to leave a B-staged coating on the polyimide film. The composite film can be laminated to an underlying electrical structure using a vacuum laminator and heat. As the heat is applied, the BCB layer softens, flows and then cures to bond the polyimide film to the underlying electrical structure.
    Type: Grant
    Filed: August 8, 1997
    Date of Patent: September 25, 2001
    Assignee: Lockheed Martin Corporation
    Inventors: Herbert Stanley Cole, Jr., Theresa Ann Sitnik-Nieters
  • Metallized vias with and method of fabrication
    Patent number: 6252304
    Abstract: A method includes applying a first seed layer extending over a horizontal surface and via sidewalls of a dielectric material and exposed underlying contact metallization; removing at least some of the first seed layer from the contact metallization and the horizontal surface while leaving a sufficient amount of the first seed layer on the sidewalls as a catalyst for subsequent application of a third seed layer; sputtering a second seed layer over the contact metallization and the horizontal surface; using an electroless solution to react with the first seed layer and apply the third seed layer over the sidewalls; and electroplating an electroplated layer over the second and third seed layers.
    Type: Grant
    Filed: December 28, 1998
    Date of Patent: June 26, 2001
    Assignee: General Electric Company
    Inventors: Herbert Stanley Cole, Jr., Wolfgang Daum
  • Method of fabricating metallized vias with steep walls
    Patent number: 5897368
    Abstract: A method includes applying a first seed layer extending over a horizontal surface and via sidewalls of a dielectric material and exposed underlying contact metallization; removing at least some of the first seed layer from the contact metallization and the horizontal surface while leaving a sufficient amount of the first seed layer on the sidewalls as a catalyst for subsequent application of a third seed layer; sputtering a second seed layer over the contact metallization and the horizontal surface; using an electroless solution to react with the first seed layer and apply the third seed layer over the sidewalls; and electroplating an electroplated layer over the second and third seed layers.
    Type: Grant
    Filed: November 10, 1997
    Date of Patent: April 27, 1999
    Assignee: General Electric Company
    Inventors: Herbert Stanley Cole, Jr., Wolfgang Daum
  • Method for making an electronic module
    Patent number: 5745984
    Abstract: A multi-chip module is provided which utilizes benzocyclobutene as a laminate adhesive for bonding the upper dielectric films in a high density interconnect structure. The benzocyclobutene thermosetting polymer is spin coated on a polyimide film, and baked at low temperature to remove any solvent to leave a B-staged coating on the polyimide film. The composite film can be laminated to an underlying electrical structure using a vacuum laminator and heat. As the heat is applied, the BCB layer softens, flows and then cures to bond the polyimide film to the underlying electrical structure.
    Type: Grant
    Filed: July 10, 1995
    Date of Patent: May 5, 1998
    Assignee: Martin Marietta Corporation
    Inventors: Herbert Stanley Cole, Jr., Theresa Ann Sitnik-Nieters