Patents by Inventor Herbert Topitsch

Herbert Topitsch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • AIN substrate and method for preparing such substrate for bonding to a copper foil
    Publication number: 20020140134
    Abstract: An AlN substrate is disclosed that can be bonded to a copper foil by a direct-copper-bonding (DCB) method. The bonding surface of the AlN substrate includes at least one auxiliary layer containing at least 50 wt. % CuAlO2 and an excess of Cu2O. Also disclosed is a process for preparing the auxiliary layer by applying a material containing copper, copper oxide and/or other copper-containing compounds, followed by an oxidation and reduction process.
    Type: Application
    Filed: March 11, 2002
    Publication date: October 3, 2002
    Applicant: ELECTROVAC, FABRIKATION ELEKTROTECHNISCHER SPEZIALARTIKEL GESELLSCHAFT M.B.H.
    Inventor: Herbert Topitsch