Patents by Inventor Herbert Wegener

Herbert Wegener has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for forming electrical connection to the inner layers of a multilayer circuit board
    Patent number: 5472735
    Abstract: The present invention relates to a method for selectively electroetching a metal from an electrical device having the steps of: immersing the electrical device in an etching solution; immersing a cathode in the etching solution; applying an etching potential to a preselected area of the metal; and maintaining a passivation potential at the metal to remain unetched. The metal to remain unetched is not electrically connected to the preselected area and the passivation potential does not equal the etching potential.The present invention further relates to a method of forming an electrical connection to the inner layers of a multilayer circuit board having a copper foil surface layer and copper containing inner layers.
    Type: Grant
    Filed: December 8, 1994
    Date of Patent: December 5, 1995
    Assignee: International Business Machines Corporation
    Inventors: Christina M. Boyko, Richard W. Carpenter, Raymond T. Galasco, Krystyna W. Semkow, Herbert Wegener
  • Selective electroetch of copper and other metals
    Patent number: 5374338
    Abstract: The present invention relates to a method for selectively electroetching a metal from an electrical device having the steps of: immersing the electrical device in an etching solution; immersing a cathode in the etching solution; applying an etching potential to a preselected area of the metal; and maintaining a passivation potential at the metal to remain unetched. The metal to remain unetched is not electrically connected to the preselected area and the passivation potential does not equal the etching potential.The present invention further relates to a method of forming an electrical connection to the inner layers of a multilayer circuit board having a copper foil surface layer and copper containing inner layers.
    Type: Grant
    Filed: October 27, 1993
    Date of Patent: December 20, 1994
    Assignee: International Business Machines Corporation
    Inventors: Christina M. Boyko, Richard W. Carpenter, Raymond T. Galasco, Krystyna W. Semkow, Herbert Wegener