Patents by Inventor Herbert Zidek

Herbert Zidek has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulated electronics device with improved heat dissipation
    Patent number: 6992400
    Abstract: A method for improving heat dissipation in an encapsulated electronic package usually referred to as a chip-size SAW package. The package comprises one or more acoustic-wave components fabricated on a die, which is disposed on an electrically non-conductive carrier separated by electrically conducting bumps. The top of the package is covered by a laminate and a hermetic seal layer. Heat dissipation can be improved by removing a part of the laminate and then depositing a layer of thermal conducting material on the package, and by providing one or more heat conducting paths through the carrier.
    Type: Grant
    Filed: January 30, 2004
    Date of Patent: January 31, 2006
    Assignees: Nokia Corporation, Epcos AG
    Inventors: Pasi Tikka, Edgar Schmidhammer, Habbo Heinze, Reiner Welzer, Herbert Zidek, Ansgar Schäufele, Juha Ellä
  • Method for improving heat dissipation in encapsulated electronic components
    Publication number: 20050167854
    Abstract: A method for improving heat dissipation in an encapsulated electronic package usually referred to as a chip-size SAW package. The package comprises one or more acoustic-wave components fabricated on a die, which is disposed on an electrically non-conductive carrier separated by electrically conducting bumps. The top of the package is covered by a laminate and a hermetic seal layer. Heat dissipation can be improved by removing a part of the laminate and then depositing a layer of thermal conducting material on the package, and by providing one or more heat conducting paths through the carrier.
    Type: Application
    Filed: January 30, 2004
    Publication date: August 4, 2005
    Inventors: Pasi Tikka, Edgar Schmidhammer, Habbo Heinze, Reiner Welzer, Herbert Zidek, Ansgar Schaufele, Juha Ella